• DocumentCode
    2255625
  • Title

    Lifecycle analysis for environmentally conscious solid freeform manufacturing

  • Author

    Luo, Yanchun ; Ji, Zhiming ; Caudill, Reggie J. ; Leu, Ming C.

  • Author_Institution
    Multi-Lifecycle Eng. Res. Center, New Jersey Inst. of Technol., Newark, NJ, USA
  • fYear
    2000
  • fDate
    2000
  • Firstpage
    33
  • Lastpage
    38
  • Abstract
    A lifecycle based process model for analyzing the environmental performance of SFM processes and SFM based rapid tooling processes is presented in this paper. The process environmental performance assessment model considers material, energy and disposal scenarios. The material use, process parameters (e.g. scanning speed) and power use can affect the environmental consequence of a process when material resource, energy, human health and environmental damage are taken into account. The presented method is applied to the SLA process and two SLA based rapid tooling processes. The method can be used to compare different rapid prototyping (RP) and RT processes in terms of their environmental friendliness and for further multi-objective decision making
  • Keywords
    environmental factors; life cycle costing; machine tools; machining; rapid prototyping (industrial); environmental damage; environmental friendliness; environmentally-conscious solid freeform manufacturing; lifecycle analysis; material use; multi-objective decision making; power use; process environmental performance assessment model; process parameters; rapid prototyping; rapid tooling processes; sterolithography process; Aerospace industry; Electronics industry; Humans; Machining; Manufacturing industries; Manufacturing processes; Performance analysis; Production; Prototypes; Solid modeling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics and the Environment, 2000. ISEE 2000. Proceedings of the 2000 IEEE International Symposium on
  • Conference_Location
    San Francisco, CA
  • ISSN
    1095-2020
  • Print_ISBN
    0-7803-5962-3
  • Type

    conf

  • DOI
    10.1109/ISEE.2000.857622
  • Filename
    857622