DocumentCode :
2256002
Title :
Finite-element modeling of thermal performance for a novel water-cooled device used in switched mode power supply
Author :
Xiaoling, Yu ; Quanke, Feng ; Guibin, Jiang
Author_Institution :
Xi´´an Jiaotong Univ., China
Volume :
2
fYear :
2004
fDate :
14-16 Aug. 2004
Firstpage :
968
Abstract :
This paper describes a novel water-cooled device used to cool secondary coils of a group of transformers in a switched mode power supply used for electroplating. The device includes a vertically bended copper board, with which a U type tube is welded. This simple device mounted on each coil tap can remove heat from three heat sources including the secondary coil, a diode under the coil tap, and two electrical resistors connected to the diode. A 3-D finite-element modeling of thermal performance of the device is presented to simulate temperature distribution of the three heat sources when they work steadily. The corresponding experimental results coincide with the simulation results, which reveal that this device can satisfy cooling requirements of the three heat sources. It has advantages of simple structure, high heat rejection efficiency and low cost.
Keywords :
coils; electroplating; finite element analysis; power transformers; switched mode power supplies; temperature distribution; bended copper board; coil tap; cool secondary coil; electrical resistor; electroplating; finite-element modeling; switched mode power supply; temperature distribution; thermal performance; transformer; water-cooled device;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Power Electronics and Motion Control Conference, 2004. IPEMC 2004. The 4th International
Conference_Location :
Xi´an
Print_ISBN :
7-5605-1869-9
Type :
conf
Filename :
1375854
Link To Document :
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