Title :
Impact of technology shrink on audio CODEC performance
Author :
Owzar, A. ; Baykal, E. ; Teng, R. ; Zheng, T. ; Helfenstein, M.
Author_Institution :
STERICSSON, Zurich, Switzerland
Abstract :
This paper presents the differences in terms of performance between 65nm and 55nm silicon for audio CODECs for mobile application. Based on representative parameters, the differences of these two technologies in terms of performance are discussed.
Keywords :
CMOS integrated circuits; audio coding; codecs; audio CODEC performance; mobile application; representative parameter; silicon; size 55 nm; size 65 nm; technology shrink;
Conference_Titel :
Microelectronics (ICM), 2010 International Conference on
Conference_Location :
Cairo
Print_ISBN :
978-1-61284-149-6
DOI :
10.1109/ICM.2010.5696154
