DocumentCode
2256103
Title
Impact of technology shrink on audio CODEC performance
Author
Owzar, A. ; Baykal, E. ; Teng, R. ; Zheng, T. ; Helfenstein, M.
Author_Institution
STERICSSON, Zurich, Switzerland
fYear
2010
fDate
19-22 Dec. 2010
Firstpage
335
Lastpage
338
Abstract
This paper presents the differences in terms of performance between 65nm and 55nm silicon for audio CODECs for mobile application. Based on representative parameters, the differences of these two technologies in terms of performance are discussed.
Keywords
CMOS integrated circuits; audio coding; codecs; audio CODEC performance; mobile application; representative parameter; silicon; size 55 nm; size 65 nm; technology shrink;
fLanguage
English
Publisher
ieee
Conference_Titel
Microelectronics (ICM), 2010 International Conference on
Conference_Location
Cairo
Print_ISBN
978-1-61284-149-6
Type
conf
DOI
10.1109/ICM.2010.5696154
Filename
5696154
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