• DocumentCode
    2256104
  • Title

    EE-Toolbox-a modular assessment system for the environmental optimization of electronics

  • Author

    Meddendorf, A. ; Nissen, N.F. ; Griese, H. ; Müller, J. ; Pötter, H. ; Reichl, H. ; Stobbe, I.

  • Author_Institution
    Fraunhofer-Inst. fur Zuverlassigkeit und Microintegration, Berlin, Germany
  • fYear
    2000
  • fDate
    2000
  • Firstpage
    166
  • Lastpage
    171
  • Abstract
    Electronic products are so complex and fast evolving that specific life cycle analysis (LCA) during the product development are still not feasible. One successful alternative is a modular evaluation concept. The spectrum of companies in electronics-from the small, specialized company where one person handles all environmental affairs to the global players with their own environmental research departments-requires a flexible mixture of basic research and reliable data generation, contract R&D, and the transfer of results and methods into management workflows. Several electronic systems mainly from information and communications products have been assessed with a different number of modules, depending on the expected or necessary width and depth of results. For all examples optimization strategies and specific improvements will be shown
  • Keywords
    electronics industry; engineering computing; environmental factors; management information systems; optimisation; product development; research and development management; CAD; EE-Toolbox; R&D management IS; contract R&D; data generation; electronic products; environmental optimization; life cycle analysis; management workflows; modular assessment system; modular evaluation concept; optimization strategies; product development; Contracts; Costs; Employment; Environmental management; Product development; Raw materials; Recycling; Reliability engineering; Research and development; Research and development management;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics and the Environment, 2000. ISEE 2000. Proceedings of the 2000 IEEE International Symposium on
  • Conference_Location
    San Francisco, CA
  • ISSN
    1095-2020
  • Print_ISBN
    0-7803-5962-3
  • Type

    conf

  • DOI
    10.1109/ISEE.2000.857643
  • Filename
    857643