DocumentCode
2256104
Title
EE-Toolbox-a modular assessment system for the environmental optimization of electronics
Author
Meddendorf, A. ; Nissen, N.F. ; Griese, H. ; Müller, J. ; Pötter, H. ; Reichl, H. ; Stobbe, I.
Author_Institution
Fraunhofer-Inst. fur Zuverlassigkeit und Microintegration, Berlin, Germany
fYear
2000
fDate
2000
Firstpage
166
Lastpage
171
Abstract
Electronic products are so complex and fast evolving that specific life cycle analysis (LCA) during the product development are still not feasible. One successful alternative is a modular evaluation concept. The spectrum of companies in electronics-from the small, specialized company where one person handles all environmental affairs to the global players with their own environmental research departments-requires a flexible mixture of basic research and reliable data generation, contract R&D, and the transfer of results and methods into management workflows. Several electronic systems mainly from information and communications products have been assessed with a different number of modules, depending on the expected or necessary width and depth of results. For all examples optimization strategies and specific improvements will be shown
Keywords
electronics industry; engineering computing; environmental factors; management information systems; optimisation; product development; research and development management; CAD; EE-Toolbox; R&D management IS; contract R&D; data generation; electronic products; environmental optimization; life cycle analysis; management workflows; modular assessment system; modular evaluation concept; optimization strategies; product development; Contracts; Costs; Employment; Environmental management; Product development; Raw materials; Recycling; Reliability engineering; Research and development; Research and development management;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics and the Environment, 2000. ISEE 2000. Proceedings of the 2000 IEEE International Symposium on
Conference_Location
San Francisco, CA
ISSN
1095-2020
Print_ISBN
0-7803-5962-3
Type
conf
DOI
10.1109/ISEE.2000.857643
Filename
857643
Link To Document