DocumentCode :
2256126
Title :
A Web-oriented, virtual product disassembly and identification method for DFE and electronic demanufacturers
Author :
Ranky, Paul G. ; Das, Sanchoy ; Caudill, Reggie J.
Author_Institution :
Dept. of Ind. & Manuf. Eng., New Jersey Inst. of Technol., Newark, NJ, USA
fYear :
2000
fDate :
2000
Firstpage :
172
Lastpage :
177
Abstract :
Application software development for Web-oriented, virtual product disassembly and identification using 3D VR (virtual reality) requires robust analytical methods, object oriented (OO) modeling and engineering multimedia for knowledge management and communication. The objective of this research is to develop the methodologies, algorithms and technologies to create a Web-based virtual electronic product disassembly system. With this computer-based tool, teams of engineers and technicians can virtually assess and visualize the scope of the disassembly problem, identify critical parts of the product, and then create a disassembly process plan. The novel aspect of this concept is that teams can share disassembly and product identification solutions, quickly identify hazardous components and proprietary components, information and data. The user can then evaluate various disassembly process sequences to maximize value of recovered materials with minimum effort and expense
Keywords :
design for environment; electronics industry; engineering computing; information resources; multimedia computing; object-oriented methods; recycling; virtual reality; 3D virtual reality; Web-oriented virtual product disassembly/identification method; application software development; design for environment; electronic demanufacturers; engineering multimedia; materials recovery; object oriented modelling; Communication industry; Computer industry; Electronics industry; Industrial electronics; Knowledge engineering; Manufacturing industries; Object oriented modeling; Product design; Virtual manufacturing; Virtual reality;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics and the Environment, 2000. ISEE 2000. Proceedings of the 2000 IEEE International Symposium on
Conference_Location :
San Francisco, CA
ISSN :
1095-2020
Print_ISBN :
0-7803-5962-3
Type :
conf
DOI :
10.1109/ISEE.2000.857644
Filename :
857644
Link To Document :
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