DocumentCode
2256126
Title
A Web-oriented, virtual product disassembly and identification method for DFE and electronic demanufacturers
Author
Ranky, Paul G. ; Das, Sanchoy ; Caudill, Reggie J.
Author_Institution
Dept. of Ind. & Manuf. Eng., New Jersey Inst. of Technol., Newark, NJ, USA
fYear
2000
fDate
2000
Firstpage
172
Lastpage
177
Abstract
Application software development for Web-oriented, virtual product disassembly and identification using 3D VR (virtual reality) requires robust analytical methods, object oriented (OO) modeling and engineering multimedia for knowledge management and communication. The objective of this research is to develop the methodologies, algorithms and technologies to create a Web-based virtual electronic product disassembly system. With this computer-based tool, teams of engineers and technicians can virtually assess and visualize the scope of the disassembly problem, identify critical parts of the product, and then create a disassembly process plan. The novel aspect of this concept is that teams can share disassembly and product identification solutions, quickly identify hazardous components and proprietary components, information and data. The user can then evaluate various disassembly process sequences to maximize value of recovered materials with minimum effort and expense
Keywords
design for environment; electronics industry; engineering computing; information resources; multimedia computing; object-oriented methods; recycling; virtual reality; 3D virtual reality; Web-oriented virtual product disassembly/identification method; application software development; design for environment; electronic demanufacturers; engineering multimedia; materials recovery; object oriented modelling; Communication industry; Computer industry; Electronics industry; Industrial electronics; Knowledge engineering; Manufacturing industries; Object oriented modeling; Product design; Virtual manufacturing; Virtual reality;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics and the Environment, 2000. ISEE 2000. Proceedings of the 2000 IEEE International Symposium on
Conference_Location
San Francisco, CA
ISSN
1095-2020
Print_ISBN
0-7803-5962-3
Type
conf
DOI
10.1109/ISEE.2000.857644
Filename
857644
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