Title :
Isolating LCDs at end-of-life using active disassembly technology: a feasibility study
Author :
Chiodo, J D ; McLaren, J. ; Billett, E.H. ; Harrison, D.J.
Author_Institution :
Cleaner Electron. Res., Brunel Univ., Egham, UK
Abstract :
The European Union draft Waste Electrical and Electronic Equipment (WEEE) directive calls for the removal and separate treatment of liquid crystal displays (LCD). This aspect of the legislation will potentially have an important impact upon the future `End of Life´ (EoL) processing of much WEEE. Active Disassembly using Smart Materials (ADSM) has been proven to have applicability in self-dismantling, nondestructive and rapid disassembly of small electronic products. This paper investigates the technical feasibility of removing LCD screens from IT communication products using ASDM technology. In this paper an option is suggested to cleanly separate LCD screens from printed circuit boards, utilizing an LCD bracket made from `shape memory polymer´. The case study products employed are Nokia Japanese J-Phones. Demonstration experiments with initial results are presented, and future developments discussed. SMB glass transformation temperatures (Tg) and time efficiency in disassembly are considered
Keywords :
design for environment; intelligent materials; legislation; liquid crystal displays; polymers; shape memory effects; Active Disassembly using Smart Materials; European Union; IT communication products; LCD; LCD bracket; LCD screens; Nokia Japanese J-Phones; SMB glass transformation temperatures; Waste Electrical and Electronic Equipment draft directive; active disassembly technology; end-of-life; legislation; liquid crystal displays; printed circuit boards; rapid nondestructive disassembly; self-dismantling; shape memory polymer; small electronic products; Crystalline materials; Electronic waste; Glass; Isolation technology; Legislation; Liquid crystal displays; Polymers; Printed circuits; Shape; Variable speed drives;
Conference_Titel :
Electronics and the Environment, 2000. ISEE 2000. Proceedings of the 2000 IEEE International Symposium on
Conference_Location :
San Francisco, CA
Print_ISBN :
0-7803-5962-3
DOI :
10.1109/ISEE.2000.857668