Title :
Localized statistical 3D thermal analysis considering Electro-Thermal coupling
Author :
Luo, Zuying ; Fan, Jeffrey ; Tan, Sheldon X D
Author_Institution :
Dept. of Electron., Beijing Normal Univ., Beijing, China
Abstract :
In this paper, we propose a novel method for analyzing fewer hot spots in a chip. The method, called SNSOR (single-node successive over relaxation), is based on a novel localized relaxed iterative approach to perform statistical analysis on one hot spot at a time. Based on SNSOR, we propose an approximation method, called ET-SNSOR (electro-thermal SNSOR), to deal with the electro-thermal coupling (ETC) effects. ET-SNSOR first uses the iterative method to update correlations from ETC, and then computes standard temperature deviations for hot spots, according to ETC and updated correlations. Experiments show that ET-SNSOR is three orders of magnitude faster than the Monte-Carlo method with small errors (less than 4.76% on maximum). It only takes an average of 0.18 second to analyze one hot spot statistically for a large test case of 1.3 M nodes with ETC effects.
Keywords :
Monte Carlo methods; approximation theory; electromagnetic coupling; iterative methods; Monte-Carlo method; approximation method; electrothermal SNSOR; electrothermal coupling; iterative approach; localized statistical 3D thermal analysis; single-node successive over relaxation; statistical analysis; Approximation methods; Iterative methods; Performance analysis; Statistical analysis; Steady-state; Temperature; Testing; Thermal conductivity; Transient analysis; Very large scale integration;
Conference_Titel :
Circuits and Systems, 2009. ISCAS 2009. IEEE International Symposium on
Conference_Location :
Taipei
Print_ISBN :
978-1-4244-3827-3
Electronic_ISBN :
978-1-4244-3828-0
DOI :
10.1109/ISCAS.2009.5117999
