Title :
Throughput maximization for wave-pipelined interconnects using cascaded buffers and transistor sizing
Author :
Wang, Li ; Mak, Terrence ; Sedcole, Pete ; Cheung, Peter Y K
Author_Institution :
Dept. of Electr. & Electron. Eng., Imperial Coll. London, London, UK
Abstract :
This paper presents two new design methodologies for throughput-centric wave-pipelined interconnects: cascaded buffers insertion and transistor sizing. Experimental results show that up to 185% throughput improvement can be achieved by applying the new proposed approaches compared with conventional interconnect optimization techniques, such as buffer insertion. Moreover, with the combination of cascaded buffers insertion and adequate techniques in supply voltage scaling, up to 60% dynamic power reduction can be gained compared to the conventional design.
Keywords :
integrated circuit interconnections; optimisation; transistors; cascaded buffer insertion; conventional interconnect optimization technique; dynamic power reduction; supply voltage scaling; throughput maximization; transistor sizing; wave-pipelined interconnect; Capacitance; Design methodology; Integrated circuit interconnections; Network-on-a-chip; Pulse width modulation inverters; Space vector pulse width modulation; Switches; TV; Throughput; Voltage;
Conference_Titel :
Circuits and Systems, 2009. ISCAS 2009. IEEE International Symposium on
Conference_Location :
Taipei
Print_ISBN :
978-1-4244-3827-3
Electronic_ISBN :
978-1-4244-3828-0
DOI :
10.1109/ISCAS.2009.5118000