• DocumentCode
    2256729
  • Title

    Throughput maximization for wave-pipelined interconnects using cascaded buffers and transistor sizing

  • Author

    Wang, Li ; Mak, Terrence ; Sedcole, Pete ; Cheung, Peter Y K

  • Author_Institution
    Dept. of Electr. & Electron. Eng., Imperial Coll. London, London, UK
  • fYear
    2009
  • fDate
    24-27 May 2009
  • Firstpage
    1293
  • Lastpage
    1296
  • Abstract
    This paper presents two new design methodologies for throughput-centric wave-pipelined interconnects: cascaded buffers insertion and transistor sizing. Experimental results show that up to 185% throughput improvement can be achieved by applying the new proposed approaches compared with conventional interconnect optimization techniques, such as buffer insertion. Moreover, with the combination of cascaded buffers insertion and adequate techniques in supply voltage scaling, up to 60% dynamic power reduction can be gained compared to the conventional design.
  • Keywords
    integrated circuit interconnections; optimisation; transistors; cascaded buffer insertion; conventional interconnect optimization technique; dynamic power reduction; supply voltage scaling; throughput maximization; transistor sizing; wave-pipelined interconnect; Capacitance; Design methodology; Integrated circuit interconnections; Network-on-a-chip; Pulse width modulation inverters; Space vector pulse width modulation; Switches; TV; Throughput; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Circuits and Systems, 2009. ISCAS 2009. IEEE International Symposium on
  • Conference_Location
    Taipei
  • Print_ISBN
    978-1-4244-3827-3
  • Electronic_ISBN
    978-1-4244-3828-0
  • Type

    conf

  • DOI
    10.1109/ISCAS.2009.5118000
  • Filename
    5118000