DocumentCode
2256729
Title
Throughput maximization for wave-pipelined interconnects using cascaded buffers and transistor sizing
Author
Wang, Li ; Mak, Terrence ; Sedcole, Pete ; Cheung, Peter Y K
Author_Institution
Dept. of Electr. & Electron. Eng., Imperial Coll. London, London, UK
fYear
2009
fDate
24-27 May 2009
Firstpage
1293
Lastpage
1296
Abstract
This paper presents two new design methodologies for throughput-centric wave-pipelined interconnects: cascaded buffers insertion and transistor sizing. Experimental results show that up to 185% throughput improvement can be achieved by applying the new proposed approaches compared with conventional interconnect optimization techniques, such as buffer insertion. Moreover, with the combination of cascaded buffers insertion and adequate techniques in supply voltage scaling, up to 60% dynamic power reduction can be gained compared to the conventional design.
Keywords
integrated circuit interconnections; optimisation; transistors; cascaded buffer insertion; conventional interconnect optimization technique; dynamic power reduction; supply voltage scaling; throughput maximization; transistor sizing; wave-pipelined interconnect; Capacitance; Design methodology; Integrated circuit interconnections; Network-on-a-chip; Pulse width modulation inverters; Space vector pulse width modulation; Switches; TV; Throughput; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Circuits and Systems, 2009. ISCAS 2009. IEEE International Symposium on
Conference_Location
Taipei
Print_ISBN
978-1-4244-3827-3
Electronic_ISBN
978-1-4244-3828-0
Type
conf
DOI
10.1109/ISCAS.2009.5118000
Filename
5118000
Link To Document