DocumentCode :
2256735
Title :
Insight into reuse of high impact polystyrene from post-consumer electronics equipment housings
Author :
Xu, Guojun ; Qiao, Jianhong ; Kuswanti, Chstiana ; Simenz, Molly ; Koelling, Kurt ; Stuart, Julie Ann ; Lilly, Blaine
Author_Institution :
Dept. of Chem. Eng., Ohio State Univ., Columbus, OH, USA
fYear :
2000
fDate :
2000
Firstpage :
348
Lastpage :
353
Abstract :
This paper focuses on engineering approaches for sustainability and design for materials reuse through preliminary studies of characterization of post-consumer resin properties and experimental blends. Because these challenges are multidisciplinary, collaboration between chemical engineering (polymer processing), industrial engineering (manufacturing processes), and mechanical engineering (product design) are described. In this paper, we describe our progress in evaluating the viability of reusing post-consumer and virgin polymer blends of high impact polystyrene from electronics equipment housings. Plastics reuse challenges are briefly reviewed, and experimental results, such as rheological properties, physical properties, simulation and design properties of a relatively thin-wall application are summarized for reuse of high impact polystyrene (HIPS) from printer and monitor housings
Keywords :
computer displays; plastics; polymer blends; printers; recycling; chemical engineering; design properties; electronics equipment housings; high impact polystyrene reuse; industrial engineering; manufacturing processes; materials reuse design; mechanical engineering; monitor housings; physical properties; plastics reuse; polymer processing; post-consumer electronics equipment housings; post-consumer polymer blends; post-consumer resin properties; printer housings; product design; rheological properties; sustainability; thin-wall application; virgin polymer blends; Chemical engineering; Collaboration; Design engineering; Electronic equipment; Industrial engineering; Manufacturing processes; Mechanical engineering; Polymers; Product design; Resins;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics and the Environment, 2000. ISEE 2000. Proceedings of the 2000 IEEE International Symposium on
Conference_Location :
San Francisco, CA
ISSN :
1095-2020
Print_ISBN :
0-7803-5962-3
Type :
conf
DOI :
10.1109/ISEE.2000.857673
Filename :
857673
Link To Document :
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