DocumentCode
2257020
Title
Creating 3D specific systems: Architecture, design and CAD
Author
Franzon, Paul D. ; Davis, W. Rhett ; Thorolffson, Thor
Author_Institution
Dept. of Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC, USA
fYear
2010
fDate
8-12 March 2010
Firstpage
1684
Lastpage
1688
Abstract
3D stacking and integration can provide system advantages. Following a brief technology review, this abstract explores application drivers, design and CAD for 3D ICs. The main application area explored in detail is that of logic on memory. This application is explored in a specific DSP example. Finally critical areas that need better solutions are explored. These include design planning, test management, and thermal management.
Keywords
CAD; digital signal processing chips; integrated circuit design; integrated memory circuits; logic circuits; logic design; stacking; three-dimensional integrated circuits; 3D IC; 3D stacking; CAD; DSP; creating 3D specific systems; design planning; logic; memory; test management; thermal management; Application software; Design automation; Dielectric substrates; Digital signal processing; Logic; Silicon; Stacking; Testing; Thermal management; Through-silicon vias; 3D IC; 3DIC; TSV; memory on logic; stacked memor; three dimensional IC;
fLanguage
English
Publisher
ieee
Conference_Titel
Design, Automation & Test in Europe Conference & Exhibition (DATE), 2010
Conference_Location
Dresden
ISSN
1530-1591
Print_ISBN
978-1-4244-7054-9
Type
conf
DOI
10.1109/DATE.2010.5457086
Filename
5457086
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