A single package transceiver for quad band EGPRS (GSM/GPRS/EDGE) class 12 applications

Author

Fitzgibbon, Morgan ; McSwiney, Diarmuid ; O´Keeffe, Dermot ; Mondal, Jyoti ; Redmond, David ; Waldie, William

Author_Institution

Freescale Semicond., Cork, Ireland

Volume

1

fYear

2005

fDate

28 Aug.-2 Sept. 2005

Abstract

This paper describes a multi component mixed process "system-in-a-package" (SIP) transceiver suitable for wireless quad band EGPRS applications. The unique approach of pursuing this SIP enables faster time to market, mitigates risk and reduces customer\´s development cycle time. This solution offers antennae-to-bits functionality using less than 250mm² of valuable board space. The Tx and Rx performance results are shown and the technology developed to implement the transceiver solution is described. The module integrates three ICs; 0.18 μm RF-CMOS for RF/analog, 0.13 μm CMOS for mixed signal analog/digital/DSP and GaAs for integrated passive devices (IPD). It contains a quad band balun plus surface mount devices (SMD) for loop filter and RF bypass. It has the complete transmit line up from digital bits (as per DigRF standard) to power amplifier interface, as well as receive function from LNA inputs to bits (per DigRF standard).

Keywords

3G mobile communication; CMOS integrated circuits; III-V semiconductors; electronics packaging; gallium arsenide; mixed analogue-digital integrated circuits; packet radio networks; radiofrequency integrated circuits; system-in-package; transceivers; 0.13 micron; 0.18 micron; DigRF standard; EDGE system; GPRS system; GSM system; GaAs; RF CMOS integrated ciscuits; RF bypass; RF-analog devices; antennae-to-bits functionality; digital signal processing; integrated passive device; loop filters; low noise amplifiers; mixed signal devices; multi component mixed process; power amplifier interface; quad band balun; single package transceiver; surface mount devices; system-in-a-package transceiver; wireless quad band EGPRS; CMOS technology; Digital signal processing; GSM; Ground penetrating radar; Packaging; RF signals; Radio frequency; Space technology; Time to market; Transceivers;

fLanguage

English

Publisher

ieee

Conference_Titel

Circuit Theory and Design, 2005. Proceedings of the 2005 European Conference on

Print_ISBN

0-7803-9066-0

Type

conf

DOI

10.1109/ECCTD.2005.1522955

Filename

1522955