DocumentCode :
2257896
Title :
SRAM cell current in low leakage design
Author :
Kwai, Ding-Ming ; Hsiao, Ching-Hua ; Kuo, Chung-Ping ; Chuang, Chi-Hsien ; Hsu, Min-Chung ; Chen, Yi-Chun ; Sung, Yu-Ling ; Pan, Hsien-Yu ; Lee, Chia-Hsin ; Chang, Meng-Fan ; Chou, Yung-Fa
Author_Institution :
Intellectual Property Libr. Co., Hsinchu
fYear :
2006
fDate :
2-4 Aug. 2006
Abstract :
This paper highlights the cell current characterization of a low leakage 6T SRAM by adjusting the threshold voltages of the transistors in the memory array to reduce the standby power. Experiments using a 0.25 mum 2.5V standard CMOS process with and without the additional threshold voltage adjustment implant on a 1Mb test chip demonstrate the effectiveness. A substantial standby power reduction by an order of magnitude is achievable. However, it incurs a wider cell current variation, which is pronounced only at a lower supply voltage. As the supply voltage decreases, the percent deviation from the average value increases. This can be modeled by a simple power-law relationship. The result has important implications in both design and manufacturing of the low leakage SRAM. Comparing with the generic cell current without the additional threshold voltage adjustment, the crossover point of their percent deviations at 2V signifies two separate circuit strategies: operating at 1.5V requires larger sensing margin and operating at 2.5V enjoys better manufacturability. Hence, for the applications requiring low voltage operations, it favors a boosted supply voltage applied to a selected cell during the read access
Keywords :
CMOS memory circuits; SRAM chips; integrated circuit design; leakage currents; 0.25 micron; 1.5 V; 2 V; 2.5 V; CMOS process; SRAM cell current; low leakage design; power-law relationship; supply voltage; threshold voltages; CMOS process; Circuits; Implants; Intellectual property; Libraries; Low voltage; Manufacturing; Random access memory; Testing; Threshold voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Memory Technology, Design, and Testing, 2006. MTDT '06. 2006 IEEE International Workshop on
Conference_Location :
Taipei
ISSN :
1087-4852
Print_ISBN :
0-7695-2572-5
Type :
conf
DOI :
10.1109/MTDT.2006.28
Filename :
1654582
Link To Document :
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