DocumentCode :
2257996
Title :
Parallel simulation of systemC TLM 2.0 compliant MPSoC on SMP workstations
Author :
Mello, Aline ; Maia, Isaac ; Greiner, Alain ; Pecheux, Francois
Author_Institution :
Lip6-Lab. d´´Inf. de Paris 6, Univ. Pierre et Marie Curie, Paris, France
fYear :
2010
fDate :
8-12 March 2010
Firstpage :
606
Lastpage :
609
Abstract :
The simulation speed is a key issue in virtual prototyping of Multi-Processors System on Chip (MPSoCs). The SystemC TLM2.0 (Transaction Level Modeling) approach accelerates the simulation by using Interface Method Calls (IMC) to implement the communications between hardware components. Another source of speedup can be exploited by parallel simulation. Multi-core workstations are becoming the mainstream, and SMP workstations will soon contain several tens of cores. The standard SystemC simulation engine uses a centralized scheduler, that is clearly the bottleneck for a parallel simulation. This paper has two main contributions. The first is a general modeling strategy for shared memory MPSoCs, called TLM-DT (Transaction Level Modeling with Distributed Time). The second is a truly parallel simulation engine, called SystemC-SMP. First experimental results on a 40 processor MPSoC virtual prototype running on a dual-core workstation demonstrate a 1.8 speedup, versus a sequential simulation.
Keywords :
digital simulation; multiprocessing systems; system-on-chip; virtual prototyping; MPSoC; SMP workstations; SystemC TLM 2.0; SystemC simulation engine; TLM-DT; distributed time; interface method calls; multicore workstations; multiprocessors system on chip; parallel simulation; transaction level modeling; virtual prototyping; Acceleration; Discrete event simulation; Hardware; Kernel; Power system modeling; System-on-a-chip; Virtual prototyping; Workstations; MPSoC; Parallel Simulation; SMP workstations; SystemC;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Design, Automation & Test in Europe Conference & Exhibition (DATE), 2010
Conference_Location :
Dresden
ISSN :
1530-1591
Print_ISBN :
978-1-4244-7054-9
Type :
conf
DOI :
10.1109/DATE.2010.5457136
Filename :
5457136
Link To Document :
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