DocumentCode :
2258019
Title :
Development of electroforming process to construction of TWT helix
Author :
Higashi, C. ; Giovedi, C. ; Motta, C.C.
Author_Institution :
Centro Tecnologico da Marinha em Sao Paulo, Brazil
Volume :
2
fYear :
2003
fDate :
20-23 Sept. 2003
Firstpage :
1085
Abstract :
The present paper presents results obtained in experiments of copper electrodeposition from an acid copper (II) sulfate bath in order to obtain a copper pipe to be used as a traveling-wave tube helix. Experimental parameters as density current, concentrations of components of the bath, agitation, temperature and additives, were studies and results obtained show that to ensure the efficiency of the electroforming process is fundamental the rigorous control of all these variables. The copper cathode with the characteristics required was obtained in the following condition: density current 1.2 A dm-2, room temperature, agitation, addition to the bath of 90 mg L-1 of NaCl and 0.5 g L-1 of glue (organic substance). The deposit of copper obtained in this condition was homogeneous without blanks and enough thickness.
Keywords :
copper; current density; electroforming; electroplating; slow wave structures; Cu; acid copper sulfate bath; copper electrodeposition; copper pipe; current density; electroforming process; electroplating; homogeneous deposit; slow-wave structure; traveling-wave tube helix; Additives; Anodes; Cathodes; Copper; Electrochemical processes; Electrodes; Fabrication; Microwave devices; Oxidation; Shape control;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microwave and Optoelectronics Conference, 2003. IMOC 2003. Proceedings of the 2003 SBMO/IEEE MTT-S International
Print_ISBN :
0-7803-7824-5
Type :
conf
DOI :
10.1109/IMOC.2003.1242873
Filename :
1242873
Link To Document :
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