Title :
Mechanism and properties of piezoresistive in rubber-matrix nanocomposites
Author :
Zhi-Min Dang ; Jun-Wei Zha ; Shehzad, Khurram ; Jing Zhang
Author_Institution :
Dept. of Polymer Sci. & Eng., Univ. of Sci. & Technol., Beijing, China
Abstract :
Advanced materials with excellent piezoresistance sensitivity are attracting more attention due that they can be used as functional materials in pressure sensors. For the researched piezoresistance nanocomposites, we employ canbon nanotubes (CNT) with difference aspect ratios as conducting functional fillers and two kinds of polymers (silicone rubber and thermoplastic elastomer) as polymer matrix, which can produce a great strain at low stress so that finally the nancomposites show outstanding piezoresistance sensitivity. Different to the carbon black (CB)/polymer composites, the CNT/polymer nanocomposites display a positive piezoresistance effect (PPRE), namely the resistance of nanocomposites increases with an increase in pressure stress. Therefore, the mechanism of PPRE is studied in this work by employing the insulating SiO2 nanoparticles and the electrical conducting CB particles as the second kind of fillers. In addition, the effect of aspect ratio (AR) of CNT on piezoresistivity was explored. A correlation between AR of MWNCNT and piezoresistivity of the corresponding composites was established.
Keywords :
carbon nanotubes; elastomers; filled polymers; nanocomposites; piezoresistance; silicone rubber; CNT-polymer nanocomposites; aspect ratio; carbon nanotubes; conducting functional fillers; electrical conducting carbon black particles; insulating SiO2 nanoparticles; piezoresistance sensitivity; piezoresistivity; polymer matrix; pressure stress; rubber-matrix nanocomposites; silicone rubber; thermoplastic elastomer; Carbon nanotubes; Nanocomposites; Piezoresistance; Polymers; Rubber; Sensitivity; canbon nanotubes; piezoresistance effect; silicon rubber; thermoplastic elastomer;
Conference_Titel :
Electrical Insulating Materials (ISEIM), Proceedings of 2011 International Conference on
Conference_Location :
Kyoto
Print_ISBN :
978-4-88686-074-3
DOI :
10.1109/ISEIM.2011.6826324