DocumentCode
2258172
Title
Mechanism and properties of piezoresistive in rubber-matrix nanocomposites
Author
Zhi-Min Dang ; Jun-Wei Zha ; Shehzad, Khurram ; Jing Zhang
Author_Institution
Dept. of Polymer Sci. & Eng., Univ. of Sci. & Technol., Beijing, China
fYear
2011
fDate
6-10 Sept. 2011
Firstpage
73
Lastpage
76
Abstract
Advanced materials with excellent piezoresistance sensitivity are attracting more attention due that they can be used as functional materials in pressure sensors. For the researched piezoresistance nanocomposites, we employ canbon nanotubes (CNT) with difference aspect ratios as conducting functional fillers and two kinds of polymers (silicone rubber and thermoplastic elastomer) as polymer matrix, which can produce a great strain at low stress so that finally the nancomposites show outstanding piezoresistance sensitivity. Different to the carbon black (CB)/polymer composites, the CNT/polymer nanocomposites display a positive piezoresistance effect (PPRE), namely the resistance of nanocomposites increases with an increase in pressure stress. Therefore, the mechanism of PPRE is studied in this work by employing the insulating SiO2 nanoparticles and the electrical conducting CB particles as the second kind of fillers. In addition, the effect of aspect ratio (AR) of CNT on piezoresistivity was explored. A correlation between AR of MWNCNT and piezoresistivity of the corresponding composites was established.
Keywords
carbon nanotubes; elastomers; filled polymers; nanocomposites; piezoresistance; silicone rubber; CNT-polymer nanocomposites; aspect ratio; carbon nanotubes; conducting functional fillers; electrical conducting carbon black particles; insulating SiO2 nanoparticles; piezoresistance sensitivity; piezoresistivity; polymer matrix; pressure stress; rubber-matrix nanocomposites; silicone rubber; thermoplastic elastomer; Carbon nanotubes; Nanocomposites; Piezoresistance; Polymers; Rubber; Sensitivity; canbon nanotubes; piezoresistance effect; silicon rubber; thermoplastic elastomer;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Insulating Materials (ISEIM), Proceedings of 2011 International Conference on
Conference_Location
Kyoto
Print_ISBN
978-4-88686-074-3
Type
conf
DOI
10.1109/ISEIM.2011.6826324
Filename
6826324
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