DocumentCode
2258192
Title
Plasma and arc microdischarges: new avenues in microfabrication
Author
Gianchandani, Yogesh B.
Author_Institution
Dept. of Electr. & Comput. Eng., Wisconsin Univ., Madison, WI, USA
fYear
2001
fDate
2001
Firstpage
423
Lastpage
426
Abstract
This paper describes the use of microdischarges between lithographically defined features as tools for further processing. Techniques based on the use of microplasmas can facilitate the microfabrication of complex microstructures (with dozens of structural levels) using just two masking steps, whereas micro-arcs can be used to increase the diversity of microstructures for WC-Co super-hard metal alloys and other unusual options
Keywords
X-ray lithography; arcs (electric); masks; micromechanical devices; plasma applications; sputter etching; WC-Co; arc microdischarges; lithographically defined features; masking steps; microfabrication; microstructures; plasma microdischarges; structural levels; super-hard metal alloys; Circuits; Diodes; Electrodes; Etching; Plasma applications; Plasma confinement; Plasma density; Plasma properties; Plasma temperature; Thyristors;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Device Research Symposium, 2001 International
Conference_Location
Washington, DC
Print_ISBN
0-7803-7432-0
Type
conf
DOI
10.1109/ISDRS.2001.984535
Filename
984535
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