• DocumentCode
    2258244
  • Title

    Proton induced single event upset in a 4M SOI SRAM

  • Author

    Liu, H.Y. ; Liu, S.T. ; Golke, K.W. ; Nelson, D.K. ; Heikkila, W.W. ; Jenkins, W.C.

  • Author_Institution
    Honeywell, Plymouth, MN, USA
  • fYear
    2003
  • fDate
    29 Sept.-2 Oct. 2003
  • Firstpage
    26
  • Lastpage
    27
  • Abstract
    A non-conventional upset mechanism is proposed to explain the proton test results for our 4M SOI SRAM for the first time in this paper. In a hardened SRAM cell where an active delay element is often used in the feedback loop, single particle hits to a single critical node are not likely to cause an SEU upset. However, when the secondary heavy ions, created by the interactions between high-energy protons and Si nuclei, travel through a critical node as well as the pass gate inside the delay element, the delay element will be shunted out by charge deposited and as a result the stored state can easily be disturbed. Simple calculations based on this assumption yield good correlation to test results in terms of upset cross-section. This upset mechanism will play a more important role as device geometries shrink.
  • Keywords
    SRAM chips; elemental semiconductors; integrated circuit modelling; integrated circuit reliability; proton effects; radiation hardening (electronics); silicon-on-insulator; 4 Mbit; SEU; SOI; SRAM; Si-SiO2; active delay element; feedback loop; high-energy protons-Si nuclei interactions; proton induced single event upset; proton test; secondary heavy ions; single critical node; Integrated circuit modeling; Integrated circuit reliability; Proton radiation effects; Radiation hardening; SRAM chips; Silicon on insulator technology;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    SOI Conference, 2003. IEEE International
  • ISSN
    1078-621X
  • Print_ISBN
    0-7803-7815-6
  • Type

    conf

  • DOI
    10.1109/SOI.2003.1242884
  • Filename
    1242884