DocumentCode
2258244
Title
Proton induced single event upset in a 4M SOI SRAM
Author
Liu, H.Y. ; Liu, S.T. ; Golke, K.W. ; Nelson, D.K. ; Heikkila, W.W. ; Jenkins, W.C.
Author_Institution
Honeywell, Plymouth, MN, USA
fYear
2003
fDate
29 Sept.-2 Oct. 2003
Firstpage
26
Lastpage
27
Abstract
A non-conventional upset mechanism is proposed to explain the proton test results for our 4M SOI SRAM for the first time in this paper. In a hardened SRAM cell where an active delay element is often used in the feedback loop, single particle hits to a single critical node are not likely to cause an SEU upset. However, when the secondary heavy ions, created by the interactions between high-energy protons and Si nuclei, travel through a critical node as well as the pass gate inside the delay element, the delay element will be shunted out by charge deposited and as a result the stored state can easily be disturbed. Simple calculations based on this assumption yield good correlation to test results in terms of upset cross-section. This upset mechanism will play a more important role as device geometries shrink.
Keywords
SRAM chips; elemental semiconductors; integrated circuit modelling; integrated circuit reliability; proton effects; radiation hardening (electronics); silicon-on-insulator; 4 Mbit; SEU; SOI; SRAM; Si-SiO2; active delay element; feedback loop; high-energy protons-Si nuclei interactions; proton induced single event upset; proton test; secondary heavy ions; single critical node; Integrated circuit modeling; Integrated circuit reliability; Proton radiation effects; Radiation hardening; SRAM chips; Silicon on insulator technology;
fLanguage
English
Publisher
ieee
Conference_Titel
SOI Conference, 2003. IEEE International
ISSN
1078-621X
Print_ISBN
0-7803-7815-6
Type
conf
DOI
10.1109/SOI.2003.1242884
Filename
1242884
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