Title :
Effects of additional Ni and Co on microstructural evolution in Sn-Ag-Bi-In solder under current stressing
Author :
Youngseok Kim ; Sugahara, Tohru ; Nagao, Shijo ; Suganuma, Katsuaki ; Ueshima, M. ; Albrecht, H. ; Wilke, Klaus ; Strogies, Joerg
Author_Institution :
ISIR, Osaka Univ., Ibaraki, Japan
Abstract :
With continuously shrinking process rules of electronic devices, the decreasing dimension of interconnections results in increasing electrical current density, and recalls the risk of massive electromigration (EM) of metal elements in solder joints. This paper reports that minor additions of Ni and/or Co to Sn-Ag-Bi-In lead-free solder to improve the EM behavior and microstructural evolutions in the solder material subjected to high electric current density of 10 kA/cm2 over 200 hours. With additional Co elements, EM resistance of solder joint was improved as twice before with microstructural evolution by it.
Keywords :
bismuth; cobalt; current density; electromigration; indium; interconnections; nickel; silver; solders; tin; EM behavior; EM resistance; Sn-Ag-Bi-In; cobalt element; current stressing; electrical current density; electronic devices; high-electric current density; interconnection dimension; lead-free solder; massive electromigration; metal elements; microstructural evolution; shrinking process rules; solder joints; solder material;
Conference_Titel :
CPMT Symposium Japan, 2012 2nd IEEE
Conference_Location :
Kyoto
Print_ISBN :
978-1-4673-2654-4
DOI :
10.1109/ICSJ.2012.6523429
