Effects of additional Ni and Co on microstructural evolution in Sn-Ag-Bi-In solder under current stressing

Author

Youngseok Kim ; Sugahara, Tohru ; Nagao, Shijo ; Suganuma, Katsuaki ; Ueshima, M. ; Albrecht, H. ; Wilke, Klaus ; Strogies, Joerg

Author_Institution

ISIR, Osaka Univ., Ibaraki, Japan

fYear

2012

fDate

10-12 Dec. 2012

Firstpage

1

Lastpage

4

Abstract

With continuously shrinking process rules of electronic devices, the decreasing dimension of interconnections results in increasing electrical current density, and recalls the risk of massive electromigration (EM) of metal elements in solder joints. This paper reports that minor additions of Ni and/or Co to Sn-Ag-Bi-In lead-free solder to improve the EM behavior and microstructural evolutions in the solder material subjected to high electric current density of 10 kA/cm² over 200 hours. With additional Co elements, EM resistance of solder joint was improved as twice before with microstructural evolution by it.

Keywords

bismuth; cobalt; current density; electromigration; indium; interconnections; nickel; silver; solders; tin; EM behavior; EM resistance; Sn-Ag-Bi-In; cobalt element; current stressing; electrical current density; electronic devices; high-electric current density; interconnection dimension; lead-free solder; massive electromigration; metal elements; microstructural evolution; shrinking process rules; solder joints; solder material;

fLanguage

English

Publisher

ieee

Conference_Titel

CPMT Symposium Japan, 2012 2nd IEEE

Conference_Location

Kyoto

Print_ISBN

978-1-4673-2654-4

Type

conf

DOI

10.1109/ICSJ.2012.6523429

Filename

6523429