DocumentCode
2258524
Title
Study on the deep-charging protection technology of space polymers modified by inorganic filler
Author
Wu Jiang ; Wang Jin-feng ; Kang Ya-li ; Zheng Xiao-quan
Author_Institution
State Key Lab. of Power Equip. & Electr. Insulation, Xi´an Jiaotong Univ., Xi´an, China
fYear
2011
fDate
6-10 Sept. 2011
Firstpage
333
Lastpage
336
Abstract
The conduction modification is an effective method to raise the releasing ability of deposited charge and to weaken the level of deep charging in polymers under space environments. The inorganic semi-conductive filler was here chosen to modify the polytetrafluoroethylene(PTFE) and polyimide(PI). With this particular filler, the conduction properties of the composites varying with the temperature and electrostatic field were measured. The experimental results indicate that, the volume conduction properties are significantly affected by the content of filler. With different content of filler, the temperature-dependent conduction property shows a regular variation and the threshold field of nonlinear conduction property under different temperatures declines obviously in particular. The modified polymer, as a new type of functional composites with reasonable conduction properties, are considered to limit the level of deep charging in the space polymers to a safe degree.
Keywords
filled polymers; inorganic polymers; insulating materials; space charge; PI; PTFE; conduction modification; deep charging protection; deposited charge; electrostatic field; inorganic semiconductive filler; nonlinear conduction property; polyimide; polytetrafluoroethylene; releasing ability; space environments; space polymers; temperature-dependent conduction property; volume conduction properties; Conductivity; Dielectrics; Insulation; Plastics; Space vehicles; Temperature; Temperature measurement; conduction property; deep charging; modification; semi-conductive filler; space polymer;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Insulating Materials (ISEIM), Proceedings of 2011 International Conference on
Conference_Location
Kyoto
Print_ISBN
978-4-88686-074-3
Type
conf
DOI
10.1109/ISEIM.2011.6826337
Filename
6826337
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