• DocumentCode
    2258524
  • Title

    Study on the deep-charging protection technology of space polymers modified by inorganic filler

  • Author

    Wu Jiang ; Wang Jin-feng ; Kang Ya-li ; Zheng Xiao-quan

  • Author_Institution
    State Key Lab. of Power Equip. & Electr. Insulation, Xi´an Jiaotong Univ., Xi´an, China
  • fYear
    2011
  • fDate
    6-10 Sept. 2011
  • Firstpage
    333
  • Lastpage
    336
  • Abstract
    The conduction modification is an effective method to raise the releasing ability of deposited charge and to weaken the level of deep charging in polymers under space environments. The inorganic semi-conductive filler was here chosen to modify the polytetrafluoroethylene(PTFE) and polyimide(PI). With this particular filler, the conduction properties of the composites varying with the temperature and electrostatic field were measured. The experimental results indicate that, the volume conduction properties are significantly affected by the content of filler. With different content of filler, the temperature-dependent conduction property shows a regular variation and the threshold field of nonlinear conduction property under different temperatures declines obviously in particular. The modified polymer, as a new type of functional composites with reasonable conduction properties, are considered to limit the level of deep charging in the space polymers to a safe degree.
  • Keywords
    filled polymers; inorganic polymers; insulating materials; space charge; PI; PTFE; conduction modification; deep charging protection; deposited charge; electrostatic field; inorganic semiconductive filler; nonlinear conduction property; polyimide; polytetrafluoroethylene; releasing ability; space environments; space polymers; temperature-dependent conduction property; volume conduction properties; Conductivity; Dielectrics; Insulation; Plastics; Space vehicles; Temperature; Temperature measurement; conduction property; deep charging; modification; semi-conductive filler; space polymer;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulating Materials (ISEIM), Proceedings of 2011 International Conference on
  • Conference_Location
    Kyoto
  • Print_ISBN
    978-4-88686-074-3
  • Type

    conf

  • DOI
    10.1109/ISEIM.2011.6826337
  • Filename
    6826337