Title :
SOI wafer polishing with magnetorheological finishing (MRF)
Author :
Tricard, Marc ; Dumas, Paul R. ; Golini, Don ; Mooney, James T.
Author_Institution :
QED Technol., Rochester, NY, USA
fDate :
29 Sept.-2 Oct. 2003
Abstract :
In this paper, SOI wafer polishing with magnetorheological finishing (MRF) process were discussed. A precision polishing method called magnetorheological finishing used to improve nominal thickness and associated thickness uniformity of the silicon layer.
Keywords :
electrolytic polishing; elemental semiconductors; magnetorheology; silicon-on-insulator; SOI wafer polishing; Si-SiO2; magnetorheological finishing; precision polishing; silicon layer; Silicon on insulator technology;
Conference_Titel :
SOI Conference, 2003. IEEE International
Print_ISBN :
0-7803-7815-6
DOI :
10.1109/SOI.2003.1242924
