A highly reliable single-crystal silicon RF-MEMS switch using Au sub-micron particles for wafer level LTCC cap packaging

Author

Katsuki, Takayuki ; Nakatani, Takeshi ; Okuda, Haruhisa ; Toyoda, O. ; Ueda, Shuichi ; Nakazawa, Fumihiko

Author_Institution

Assoc. of Super-Adv. Electron. Technol., Akashi, Japan

fYear

2012

fDate

10-12 Dec. 2012

Firstpage

1

Lastpage

4

Abstract

This paper presents a small packaged, reliable and low-voltage driven RF-MEMS switch for wireless communication. We developed novel fabrication process of an RF-MEMS switch using a PZT actuator without a backside cavity to realize wafer-level-packaging (WLP). We also developed organic-free WLP process using sub-micron Au particles simultaneously to contact electrically and to seal hermetically with a low temperature co-fired ceramics (LTCC) wafer as a cap on a multilevel height RF switch. As a result, we obtained a small packaged SPST switch, which is in the small size of 1.4 × 0.9 × 0.8 mm. The RF-MEMS switch operated keeping a low contact resistance (<;3 Ω) up to 1 billion cycles at a low-power condition (DC 1 mW).

Keywords

ceramic packaging; elemental semiconductors; gold; microswitches; radiocommunication; silicon; wafer level packaging; Au; PZT actuator; RF-MEMS switch; SPST switch; Si; low temperature co-fired ceramics wafer; power 1 mW; size 0.8 mm; size 0.9 mm; size 1.4 mm; sub-micron particles; wafer level LTCC cap packaging; wafer-level-packaging; wireless communication;

fLanguage

English

Publisher

ieee

Conference_Titel

CPMT Symposium Japan, 2012 2nd IEEE

Conference_Location

Kyoto

Print_ISBN

978-1-4673-2654-4

Type

conf

DOI

10.1109/ICSJ.2012.6523461

Filename

6523461