• DocumentCode
    2259267
  • Title

    Nano-uniformity control in Unibond® process

  • Author

    Maleville, C. ; Neyret, E. ; Mohamed, Nadia Ben ; Maunand-Tussot, Corinne ; Delprat, Daniel

  • Author_Institution
    SOITEC S.A., Bernin, France
  • fYear
    2003
  • fDate
    29 Sept.-2 Oct. 2003
  • Firstpage
    140
  • Lastpage
    141
  • Abstract
    This paper deals with uniformity control in Unibond process, monitored from wafer scale down to device level scale, with a discussion of metrology solutions that are utilized.
  • Keywords
    elemental semiconductors; nanotechnology; silicon; silicon-on-insulator; thickness control; wafer bonding; Si; metrology solutions; nanouniformity control; thickness controle; unibond process; wafer-device level scale; Nanotechnology; Silicon; Silicon on insulator technology; Thickness control; Wafer bonding;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    SOI Conference, 2003. IEEE International
  • ISSN
    1078-621X
  • Print_ISBN
    0-7803-7815-6
  • Type

    conf

  • DOI
    10.1109/SOI.2003.1242929
  • Filename
    1242929
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2259267