Title :
Nano-uniformity control in Unibond® process
Author :
Maleville, C. ; Neyret, E. ; Mohamed, Nadia Ben ; Maunand-Tussot, Corinne ; Delprat, Daniel
Author_Institution :
SOITEC S.A., Bernin, France
fDate :
29 Sept.-2 Oct. 2003
Abstract :
This paper deals with uniformity control in Unibond process, monitored from wafer scale down to device level scale, with a discussion of metrology solutions that are utilized.
Keywords :
elemental semiconductors; nanotechnology; silicon; silicon-on-insulator; thickness control; wafer bonding; Si; metrology solutions; nanouniformity control; thickness controle; unibond process; wafer-device level scale; Nanotechnology; Silicon; Silicon on insulator technology; Thickness control; Wafer bonding;
Conference_Titel :
SOI Conference, 2003. IEEE International
Print_ISBN :
0-7803-7815-6
DOI :
10.1109/SOI.2003.1242929
