Title :
Multi-temperature testing for core-based system-on-chip
Author :
He, Zhiyuan ; Peng, Zebo ; Eles, Petru
Author_Institution :
Dept. of Comput. & Inf. Sci., Linkoping Univ., Linkoping, Sweden
Abstract :
Recent research has shown that different defects can manifest themselves as failures at different temperature spectra. Therefore, we need multi-temperature testing which applies tests at different temperature levels. In this paper, we discuss the need and problems for testing core-based systems-on-chip at different temperatures. To address the long test time problem for multi-temperature test, we propose a test scheduling technique that generates the shortest test schedules while keeping the cores under test within a temperature interval. Experimental results show the efficiency of the proposed technique.
Keywords :
scheduling; system-on-chip; thermal analysis; core based system-on-chip; multitemperature testing; test scheduling technique; Circuit testing; Delay; Frequency; Job shop scheduling; Power supplies; System testing; System-on-a-chip; Temperature sensors; Very large scale integration; Voltage; multi-temperature testing; system-on-chip test; test scheduling; thermal-aware test;
Conference_Titel :
Design, Automation & Test in Europe Conference & Exhibition (DATE), 2010
Conference_Location :
Dresden
Print_ISBN :
978-1-4244-7054-9
DOI :
10.1109/DATE.2010.5457209