DocumentCode :
2259613
Title :
A non-dimensional correlation for the external thermal characteristics of surface mount metal quad flat packs
Author :
Shaukatullah, H. ; Gaynes, Michael A. ; White, Lawrence H.
Author_Institution :
Microelectronics Div., IBM Corp., Endicott, NY, USA
fYear :
1994
fDate :
4-7 May 1994
Firstpage :
237
Lastpage :
244
Abstract :
A non-dimensional correlation has been developed for the external thermal characteristics (case-to-air thermal resistance) of a surface mount metal quad flat pack in the mixed convection regime. This correlation uses Reynolds, Prandtl and modified Nusselt and Raleigh numbers, and is based on the model proposed by Churchill for correlating heat and mass transfer from simple surfaces, like flat plates. This modified Nusselt number can be interpreted as a non-dimensional external (case-to-air) thermal resistance. Cavity-down type 28 mm 208-leaded metal quad flat packs were tested to determine their thermal characteristics over a range of powers and air flow velocities. All the data up to 2 m/s air flow velocity was fitted to the proposed non-dimensional correlation with a maximum deviation of 5%. Such a non-dimensional correlation for the thermal characteristics of electronic packages provides a convenient basis for interpolating and extrapolating the test data. It also provides a simple way for using the laboratory test data at nominal temperatures and sea level conditions to estimate the thermal performance at higher temperatures and altitudes. This paper describes the tests that were done for characterizing the thermal performance of surface mount metal quad flat packs, and reviews the development of the non-dimensional correlation to represent the external thermal resistance
Keywords :
convection; surface mount technology; thermal resistance; 2 m/s; 28 mm; Nusselt number; Prandtl number; Raleigh number; Reynolds number; air flow; case-to-air thermal resistance; cavity-down type packs; electronic packages; external thermal characteristics; flat plates; heat transfer; mass transfer; mixed convection; nondimensional correlation; surface mount metal quad flat packs; surfaces; Electronic equipment testing; Electronic packaging thermal management; Electronics packaging; Heat transfer; Laboratories; Ocean temperature; Sea level; Sea surface; Surface resistance; Thermal resistance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal Phenomena in Electronic Systems, 1994. I-THERM IV. Concurrent Engineering and Thermal Phenomena., InterSociety Conference on
Conference_Location :
Washington, DC
Print_ISBN :
0-7803-1372-0
Type :
conf
DOI :
10.1109/ITHERM.1994.342892
Filename :
342892
Link To Document :
بازگشت