DocumentCode :
2259746
Title :
Enhancement of two-phase thermosyphon for cooling high heat flux power devices
Author :
Kuwahara, Heikichi ; Takahashi, Kenji ; Nakajima, Tadakatsu ; Suzuki, Osamu ; Takasaki, Toshio
Author_Institution :
Mech. Eng. Res. Lab., Hitachi Ltd., Ibaraki, Japan
fYear :
1994
fDate :
4-7 May 1994
Firstpage :
184
Lastpage :
189
Abstract :
The purpose of this study is the enhancement of cooling of high heat flux power devices such as a thyristor by a thermosyphon system. The thermosyphon used boiling and condensation of inert dielectric fluorocarbon (FC-72). Boiling occurred from a multiple chimney heat transfer structure. A boiling chamber is connected to the condenser by a double tube, with the inner tube carrying the condensed liquid and the outer annulus carrying vapor. Using the experimental model of a thermosyphon, heat flux capacity was enhanced by increasing the flow tube height Ho, boiling chamber height Hh, and condenser liquid level Hl. High heat flux capacity was achieved with H 0>8 cm, Hh>10 cm, and Hl>H0, using chimney heat transfer structure with a channel width of 3 mm. The thermosyphon system was able to cool a maximum heat flux of 3 kW per device
Keywords :
cooling; power electronics; thyristors; 3 kW; FC-72; boiling chamber; condensation; cooling; double tube; high heat flux power devices; inert dielectric fluorocarbon; multiple chimney heat transfer structure; thyristor; two-phase thermosyphon; Cooling; Dielectrics; Heat engines; Heat sinks; Heat transfer; Mechanical engineering; Particle separators; Refrigerants; Space heating; Thyristors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal Phenomena in Electronic Systems, 1994. I-THERM IV. Concurrent Engineering and Thermal Phenomena., InterSociety Conference on
Conference_Location :
Washington, DC
Print_ISBN :
0-7803-1372-0
Type :
conf
DOI :
10.1109/ITHERM.1994.342898
Filename :
342898
Link To Document :
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