Title :
Power module with new features for SiC devices
Author :
Iizuka, Yuki ; Nashida, Norihiro ; Horio, Masafumi ; Nakamura, Yoshihiko ; Ikeda, Yasuhiro
Author_Institution :
Fuji Electr. Co., Ltd., Fuji, Japan
Abstract :
A newly developed structure package has been investigated. It has new features, multi-pin attached interconnections and epoxy encapsulation. The pin interconnection provide large current capability for the power module. Due to the epoxy encapsulation, FEA and power-cycling test proved their superior characteristics of reliability. It has a both features for high-density packaging and high reliability, to realize large current capabilities and high temperature operation, as one of the potential candidates to next generation power module with SiC devices.
Keywords :
encapsulation; power semiconductor devices; semiconductor device reliability; silicon compounds; wide band gap semiconductors; SiC; epoxy encapsulation; high density packaging; multipin attached interconnections; next generation power module; pin interconnection; Copper; Encapsulation; Integrated circuit interconnections; Multichip modules; Reliability; Silicon carbide; Encapsulation; Packaging; Power Module; Reliability; Wire-bond-less;
Conference_Titel :
Electrical Insulating Materials (ISEIM), Proceedings of 2011 International Conference on
Conference_Location :
Kyoto
Print_ISBN :
978-4-88686-074-3
DOI :
10.1109/ISEIM.2011.6826395
