DocumentCode
2259910
Title
A unified predictive TFT model with capability for statistical simulation
Author
Singh, Jagar ; Shengdong Zhang ; Wang, Hongmei ; Chan, Mansun
Author_Institution
Dept of Electr. & Electron. Eng., Hong Kong Univ. of Sci. & Technol., Kowloon, China
fYear
2001
fDate
2001
Firstpage
657
Lastpage
660
Abstract
An accurate polysilicon Thin-Film-Transistor (TFT) model is important for the development of TFT circuits in AMLCD and 3D integrations. The desire to have large polysilicon grain for TFT fabrications has lead to the development of grain enhancement processes (such as MILC, laser annealing). These technologies result in significant variation in TFT characteristics from technology to technology, and create difficulty in the modeling of TFT circuits. In this paper, we have developed a physical based TFTs model by considering the grain structure in the channel region. The formulation is inherent from the BSIM industrial standard model for MOSFETs, and thus all MOS related physics are incorporated automatically and it can be easily implemented in SPICE. The performance variations due to different polysilicon grain size resulting from the fabrication technology have been incorporated. The model can be used to predict the device-to-device variation of a given. The model has been applied to 3 different technologies and excellent agreement with the experimental result is observed
Keywords
MOSFET; SPICE; elemental semiconductors; grain boundaries; semiconductor device models; silicon; standards; statistical analysis; thin film transistors; AMLCD; BSIM industrial standard model; MOSFET; SPICE; Si; TFT fabrications; TFT model; channel region; grain enhancement; grain structure; polysilicon; polysilicon grain; statistical simulation; Active matrix liquid crystal displays; Annealing; Circuits; Laser modes; Laser theory; MOSFETs; Optical device fabrication; Physics; Predictive models; Thin film transistors;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Device Research Symposium, 2001 International
Conference_Location
Washington, DC
Print_ISBN
0-7803-7432-0
Type
conf
DOI
10.1109/ISDRS.2001.984607
Filename
984607
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