Title :
Transient thermal behaviour of a board-mounted 160-lead plastic quad flat pack
Author :
Lohan, J. ; Davies, M.
Author_Institution :
Dept. of Mech. & Production Eng., Limerick Univ., Ireland
Abstract :
Severe transient thermal effects are induced in electronic components during assembly, reliability testing and operation. Although component reliability is a strong function of temperature, there is no absolute relationship to describe its dependency on the environmental conditions imposed by these processes. In this paper, the thermal response of a board-mounted 160-lead plastic quad flat pack to typical reliability test environments was investigated experimentally. The steady state thermal performance of the component in forced convection, and its unsteady response to air temperature cycling, power cycling and a combination of these were evaluated. The effects of various test cycle configurations, consisting of different air temperature ramp rates, dwell times, power level and air velocity, on the component response are clearly shown
Keywords :
circuit reliability; convection; cooling; environmental testing; integrated circuit testing; packaging; printed circuits; thermal analysis; thermal resistance measurement; 160-lead package; PQFP; QFP; air temperature cycling; air temperature ramp rates; air velocity; board-mounted package; component response; dwell times; forced convection; plastic quad flat pack; power cycling; power level; reliability test environments; thermal response; transient thermal behaviour; transient thermal effects; Assembly; Circuit testing; Electronic components; Electronic equipment testing; Electronic switching systems; Electronics packaging; Plastics; Soldering; Temperature dependence; Thermal stresses;
Conference_Titel :
Thermal Phenomena in Electronic Systems, 1994. I-THERM IV. Concurrent Engineering and Thermal Phenomena., InterSociety Conference on
Conference_Location :
Washington, DC
Print_ISBN :
0-7803-1372-0
DOI :
10.1109/ITHERM.1994.342908
