DocumentCode :
2260208
Title :
Single-phase and boiling cooling of small pin fin arrays by multiple slot nozzle suction and impingement
Author :
Copeland, David
Author_Institution :
Inst. of Mech. & Intelligent Syst. Eng., Tokyo Inst. of Technol., Japan
fYear :
1994
fDate :
4-7 May 1994
Firstpage :
16
Lastpage :
22
Abstract :
Experimental measurements of forced convection single-phase and boiling heat transfer from pin fin arrays were made using fluorocarbon liquid FC-72. Liquid flow was directed to and from the pin fin arrays by multiple slot nozzles, alternately providing suction and impingement flow. Rectangular pin fin arrays having equal width and spacing of 0.1 and 0.2 mm and aspect ratios of 1, 2.25 and 5 were machined from 1 cm square copper blocks, providing total surface areas of 200 to 600 mm2. The multiple slot nozzles featured alternating inlet and outlet channels 1 mm wide on a 2 mm pitch, providing inlet and outlet cross-sectional areas of 25 mm2. Flow rates of 1.25 to 10 cm 3/s (0.075 to 0.6 l/min) were tested, resulting in inlet and outlet velocities of 0.05 to 0.4 m/s and pin fin array velocities from 0.05 to 4.0 m/s. The range of flow rates and pin fin geometries provided single-phase heat transfer coefficients (based on planform area) from 5.2 to 38.5 kW/m2K and critical heat flux from 89 to 369 W/cm 2 at an inlet temperature of 16°C, corresponding to 40°C subcooling. At a fixed pin fin aspect ratio and liquid flow rate, reducing pin fin width from 0.2 mm to 0.1 mm increased single-phase heat transfer by an average of 7%, while critical heat flux remained constant. Correlations of the single-phase heat transfer coefficient and critical heat flux as functions of liquid flow rate, pin fin aspect ratio and width are provided
Keywords :
boiling; convection; cooling; heat sinks; nozzles; packaging; 0.05 to 4.0 m/s; 0.1 mm; 16 degC; aspect ratios; boiling cooling; critical heat flux; fluorocarbon liquid FC-72; forced convection; impingement flow; inlet channels; liquid flow; liquid flow rate; multiple slot nozzle suction; multiple slot nozzles; outlet channels; single-phase cooling; small pin fin arrays; Cooling; Copper; Fluid flow; Heat transfer; Intelligent systems; Mechanical variables measurement; Microchannel; Phased arrays; Systems engineering and theory; Temperature;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal Phenomena in Electronic Systems, 1994. I-THERM IV. Concurrent Engineering and Thermal Phenomena., InterSociety Conference on
Conference_Location :
Washington, DC
Print_ISBN :
0-7803-1372-0
Type :
conf
DOI :
10.1109/ITHERM.1994.342918
Filename :
342918
Link To Document :
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