Title :
Proceedings of 1994 4th Intersociety Conference on Thermal Phenomena in Electronic Systems (I-THERM)
Abstract :
The following topics were dealt with: single and multi-phase convective cooling of components; experimental and numerical modeling of air cooling devices; temperature dependent failures; thermal phenomena in peripheral equipment
Keywords :
convection; cooling; failure analysis; integrated circuit technology; packaging; air cooling devices; electronic systems; multi-phase convective cooling; numerical modeling; peripheral equipment; single phase convective cooling; temperature dependent failures; thermal phenomena;
Conference_Titel :
Thermal Phenomena in Electronic Systems, 1994. I-THERM IV. Concurrent Engineering and Thermal Phenomena., InterSociety Conference on
Conference_Location :
Washington, DC, USA
Print_ISBN :
0-7803-1372-0
DOI :
10.1109/ITHERM.1994.342921
