DocumentCode :
2260324
Title :
Design of a Silicon Carbide JFET based operational amplifier for gain and CMRR performance
Author :
Maralani, Ayden ; Mazzola, Michael S.
Author_Institution :
Dept. of Electr. & Comput. Eng., Mississippi State Univ., Starkville, MS, USA
fYear :
2009
fDate :
24-27 May 2009
Firstpage :
1953
Lastpage :
1956
Abstract :
Although silicon carbide (SiC) JFETs are superior candidates for high temperature and harsh environment applications, they exhibit significant design challenges even at room temperature, such as low intrinsic gain and low gate to source voltage range (GSVR) requirement. The primary goal of this paper is to present an opportunity demonstrating the feasibility of a fully SiC JFET based operational amplifier (opamp). Considering wide bandgap property of SiC material, the same design is not feasible using silicon JFETs. An opamp based on two types of enhancement and depletion mode SiC JFETs is designed, fabricated, and tested. Before designing the opamp, enhancement and depletion mode SiC JFETs are characterized and modeled for SPICE and simulation. In order to offset the low intrinsic gain effect of the transistors and achieve high overall gain and common mode rejection ratio (CMRR), gain enhancing design techniques such as cascoding and bootstrapping are applied in a way that low GSVR requirement is taken into account. The performance of the final opamp shows 67 dB of open loop gain and 73 dB of CMRR.
Keywords :
junction gate field effect transistors; operational amplifiers; silicon compounds; wide band gap semiconductors; JFET; SPICE; SiC; common mode rejection ratio; depletion mode; enhancement mode; gain enhancing design techniques; low gate to source voltage range; low intrinsic gain; operational amplifier; wide bandgap property; Analog circuits; Circuit simulation; JFET circuits; MESFETs; Operational amplifiers; Performance gain; SPICE; Silicon carbide; Temperature; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Circuits and Systems, 2009. ISCAS 2009. IEEE International Symposium on
Conference_Location :
Taipei
Print_ISBN :
978-1-4244-3827-3
Electronic_ISBN :
978-1-4244-3828-0
Type :
conf
DOI :
10.1109/ISCAS.2009.5118172
Filename :
5118172
Link To Document :
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