Title :
Service-Oriented Embedded Device Model in Industrial Automation
Author :
Li, Quan ; Shu, Yuanzhong ; Tao, Chenggong ; Peng, Xiaohong ; Shi, Hui
Author_Institution :
Sch. of Comput., Nanchang Hangkong Univ., Nanchang
Abstract :
Embedded devices are more and more widely used in the field of industrial automation. In order to improve enterprise´s market adaptability, meet the changing requirement of new production manufacturing, and satisfy the flexible adjusting of manufacturing systems, the device layer and enterprise layer should be connected and integrated seamlessly. A service-oriented embedded device model is proposed. The embedded devices are modeled using SOA. The device´s functions are abstracted into services. Simple or complex services can be called directly by other devices or enterprise information system. The structure, modules and functional requirements of service-oriented embedded device model are discussed. An experimental model of industrial production system is constructed through the DPWS protocol and gSOAP toolkit in the distributed environment. The test result indicates that service-oriented embedded device model can satisfy the seamless connection, autonomous management and rapid and flexible integration among devices in the manufacturing system.
Keywords :
Web services; embedded systems; factory automation; information systems; manufacturing systems; software architecture; embedded device model; enterprise information system; enterprise market adaptability; industrial automation; production manufacturing system; service-oriented architecture; Computer industry; Embedded computing; Intelligent sensors; Manufacturing automation; Manufacturing industries; Manufacturing systems; Production systems; Protocols; Service oriented architecture; Web services; Embedded device; Industrial automation; SOA; device model;
Conference_Titel :
Intelligent Information Technology Application, 2008. IITA '08. Second International Symposium on
Conference_Location :
Shanghai
Print_ISBN :
978-0-7695-3497-8
DOI :
10.1109/IITA.2008.299