DocumentCode :
2260582
Title :
Prediction of Silicon Content in Hot Metal Based on the Combined Model of EMD and SVM
Author :
Wang, Yikang ; Liu, Xiangguan
Author_Institution :
Coll. of Sci., China Jiliang Univ., Hangzhou
Volume :
1
fYear :
2008
fDate :
20-22 Dec. 2008
Firstpage :
561
Lastpage :
565
Abstract :
In blast furnace (BF) ironmaking process, silicon content in hot metal is an important index, which reflects the thermal state of BF. To predict the silicon content in hot metal effectively and level up the forecasting accuracy, a novel combined model based on empirical mode decomposition (EMD) and support vector machine (SVM) is proposed. Firstly, the time series data of silicon content in hot metal are decomposed into a series of stationary intrinsic mode functions (IMF) in different scale space via EMD sifting procedure. The local features of original time series data are prominent in the IMFs. Secondly, based on the analysis of Lemple-Ziv complexity and 10-fold cross validation, the right kernel functions and their parameters are chosen to build different SVMs respectively to predict each IMF. Finally, the predicted results of all IMFs are reconstructed to obtain final predicted result which shows that the prediction is successful and the hit rate increased to 90%.
Keywords :
blast furnaces; forecasting theory; hot working; silicon compounds; steel industry; support vector machines; time series; Lemple-Ziv complexity; SVM; Si; blast furnace ironmaking process; blast furnace thermal state; empirical mode decomposition; forecasting accuracy; hot metal; intrinsic mode function; kernel function; silicon content prediction; support vector machine; time series data; Algorithm design and analysis; Blast furnaces; Information technology; Mathematical model; Mathematics; Neural networks; Predictive models; Signal processing; Silicon; Support vector machines;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Intelligent Information Technology Application, 2008. IITA '08. Second International Symposium on
Conference_Location :
Shanghai
Print_ISBN :
978-0-7695-3497-8
Type :
conf
DOI :
10.1109/IITA.2008.112
Filename :
4739635
Link To Document :
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