• DocumentCode
    2260665
  • Title

    SiGe class-E power amplifier with envelope tracking for mobile WiMAX/Wibro applications

  • Author

    Li, Yan ; Lopez, Jerry ; Lie, Donald Y C ; Chen, Kevin ; Wu, Stanley ; Yang, Tzu-Yi

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Texas Tech Univ., Lubbock, TX, USA
  • fYear
    2009
  • fDate
    24-27 May 2009
  • Firstpage
    2017
  • Lastpage
    2020
  • Abstract
    In this paper, we report both circuits design and system simulations using highly-efficient monolithic SiGe class-E power amplifier (PA) with an open-loop envelope tracking (ET) technique for mobile WiMAX/Wibro applications. The 1-stage and 2-stage class-E PAs were designed and fabricated in a 0.18 mum BiCMOS SiGe technology. The 1-stage class-E PA achieved peak power added efficiency (PAE) of 62% at output power of 21 dBm in single-tone measurement. The design of linear-assisted switching envelope amplifier is also discussed, which involves balancing the tradeoff between efficiency and signal fidelity. Detailed co-design system simulations including RF circuits and digital DSP blocks show that our class-E PA can be linearized by the open-loop ET technique, and the entire ET-based transmit (TX) system meets the stringent 802.16e TX mask with ~33% overall average efficiency at output power of 18.5 dBm.
  • Keywords
    BiCMOS integrated circuits; Ge-Si alloys; WiMax; open loop systems; power amplifiers; BiCMOS; SiGe; SiGe technology; Wibro; mobile WiMAX; open-loop envelope tracking; power added efficiency; power amplifier; BiCMOS integrated circuits; Circuit simulation; Circuit synthesis; Germanium silicon alloys; High power amplifiers; Power amplifiers; Power generation; Power measurement; Silicon germanium; WiMAX;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Circuits and Systems, 2009. ISCAS 2009. IEEE International Symposium on
  • Conference_Location
    Taipei
  • Print_ISBN
    978-1-4244-3827-3
  • Electronic_ISBN
    978-1-4244-3828-0
  • Type

    conf

  • DOI
    10.1109/ISCAS.2009.5118188
  • Filename
    5118188