• DocumentCode
    2261302
  • Title

    A large-scale Reconfigurable Smart Sensory Chip

  • Author

    Peng, Sheng-Yu ; Gurun, Gokce ; Twigg, Christopher M. ; Qureshi, Muhammad S. ; Basu, Arindam ; Brink, Stephen ; Hasler, Paul E. ; Degertekin, F.L.

  • Author_Institution
    Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
  • fYear
    2009
  • fDate
    24-27 May 2009
  • Firstpage
    2145
  • Lastpage
    2148
  • Abstract
    The Reconfigurable Smart Sensory Chip (RSSC) is a powerful tool for fast prototyping sensory microsystems. Innovative design ideas can be quickly realized and tested in hardware without doing time-consuming and expensive silicon fabrication. The RSSC is a large-scale floating-gate based IC containing 8 universal sensor interface blocks, each of which can be configured for voltage sensing, capacitive sensing, or current sensing, and 28 configurable analog blocks. The outputs of the interface circuits can be multiplexed out in a time-division sequence or can be routed to the configurable analog blocks for further analog signal processing or data conversion. With more than 50,000 programmable elements and on-chip programming circuitry, RSSC is an extremely powerful tool to develop and test a great variety of smart sensory microsystems in minutes.
  • Keywords
    capacitive sensors; electric current measurement; intelligent sensors; mixed analogue-digital integrated circuits; programmable circuits; voltage measurement; analog signal processing; capacitive sensing; configurable analog blocks; current sensing; data conversion; interface circuits; large-scale floating-gate based IC; large-scale reconfigurable smart sensory chip; on-chip programming circuitry; smart sensory microsystems; time division sequence; voltage sensing; Analog integrated circuits; Capacitive sensors; Circuit testing; Fabrication; Hardware; Intelligent sensors; Large-scale systems; Prototypes; Silicon; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Circuits and Systems, 2009. ISCAS 2009. IEEE International Symposium on
  • Conference_Location
    Taipei
  • Print_ISBN
    978-1-4244-3827-3
  • Electronic_ISBN
    978-1-4244-3828-0
  • Type

    conf

  • DOI
    10.1109/ISCAS.2009.5118220
  • Filename
    5118220