DocumentCode :
2261548
Title :
Session IV: Packaging
fYear :
2009
fDate :
11-11 Oct. 2009
Firstpage :
109
Lastpage :
110
Abstract :
Start of the above-titled section of the conference proceedings record.
Keywords :
Electron Devices Society; Electronics packaging; Gallium arsenide; Reliability engineering;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Reliability of Compound Semiconductors Digest (ROCS), 2009
Conference_Location :
Greensboro, NC
Print_ISBN :
978-0-7908-0124-7
Type :
conf
Filename :
5313971
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2261548