DocumentCode :
2261883
Title :
Comparison of DC measurement methods to determine GaN HEMT reliability
Author :
Pazirandeh, R. ; Würfl, J. ; Tränkle, G.
Author_Institution :
Ferdinand-Braun-Inst. fur Hochstfrequenztechnik, Berlin, Germany
fYear :
2009
fDate :
11-11 Oct. 2009
Firstpage :
41
Lastpage :
51
Abstract :
In this paper we compare methods to determine the life-time of AlGaN/GaN HEMTs by accelerated DC life-tests. They all base on monitoring of both, IDSS and IDQ during the life-test, either at room temperature of at the elevated ambient temperature. The goal is to investigate whether interruptions of the life test to measure IDSS at room temperature can be prevented and replaced by screening this parameter during the life test at higher temperature. The investigation shows that the so called intrinsic IDSS measurement is a quite interesting and helpful tool, but too often measurement of this parameter adds additional stress to the device. In addition we saw that intermediate measurements did not stress the devices as suspected. We also observed that for stress tests at constant PDiss the drift of the gate voltage can be used as failure criterion, although it has no linear relationship to IDSS and therefore the gate voltage drifts more than IDSS and leads to more conservative life-time.
Keywords :
III-V semiconductors; aluminium compounds; gallium compounds; high electron mobility transistors; life testing; semiconductor device reliability; semiconductor device testing; wide band gap semiconductors; AlGaN-GaN; DC life-test; DC measurement; HEMT reliability; gate voltage drift; room temperature; stress test; temperature 293 K to 298 K; Acceleration; Aluminum gallium nitride; Decision support systems; Gallium nitride; HEMTs; Life testing; Monitoring; Stress measurement; Temperature; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Reliability of Compound Semiconductors Digest (ROCS), 2009
Conference_Location :
Greensboro, NC
Print_ISBN :
978-0-7908-0124-7
Type :
conf
Filename :
5313983
Link To Document :
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