DocumentCode :
2261976
Title :
[Copyright notice]
fYear :
2013
fDate :
4-6 March 2013
Firstpage :
1
Lastpage :
1
Abstract :
The following topics are dealt with: three dimensional circuits; three dimensional packaging; aging aware design; system level energy; low power system design; global circuit design; CAD; 3D IC; low power technologies; silicon diagnosis; multiprocessor systems; nanometer technologies; power integrity; and reliable system design.
Keywords :
CAD; CMOS integrated circuits; circuit testing; electronics packaging; elemental semiconductors; low-power electronics; multiprocessing systems; network routing; network synthesis; silicon; three-dimensional integrated circuits; 3D IC; CAD; aging aware design; global circuit design; low power system design; low power technologies; multiprocessor systems; nanometer technologies; power integrity; reliable system design; silicon diagnosis; silicon test; system level energy; three dimensional circuits; three dimensional packaging;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Quality Electronic Design (ISQED), 2013 14th International Symposium on
Conference_Location :
Santa Clara, CA
ISSN :
1948-3287
Print_ISBN :
978-1-4673-4951-2
Type :
conf
DOI :
10.1109/ISQED.2013.6523575
Filename :
6523575
Link To Document :
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