Title :
[Copyright notice]
Abstract :
The following topics are dealt with: three dimensional circuits; three dimensional packaging; aging aware design; system level energy; low power system design; global circuit design; CAD; 3D IC; low power technologies; silicon diagnosis; multiprocessor systems; nanometer technologies; power integrity; and reliable system design.
Keywords :
CAD; CMOS integrated circuits; circuit testing; electronics packaging; elemental semiconductors; low-power electronics; multiprocessing systems; network routing; network synthesis; silicon; three-dimensional integrated circuits; 3D IC; CAD; aging aware design; global circuit design; low power system design; low power technologies; multiprocessor systems; nanometer technologies; power integrity; reliable system design; silicon diagnosis; silicon test; system level energy; three dimensional circuits; three dimensional packaging;
Conference_Titel :
Quality Electronic Design (ISQED), 2013 14th International Symposium on
Conference_Location :
Santa Clara, CA
Print_ISBN :
978-1-4673-4951-2
DOI :
10.1109/ISQED.2013.6523575
