DocumentCode
2261976
Title
[Copyright notice]
fYear
2013
fDate
4-6 March 2013
Firstpage
1
Lastpage
1
Abstract
The following topics are dealt with: three dimensional circuits; three dimensional packaging; aging aware design; system level energy; low power system design; global circuit design; CAD; 3D IC; low power technologies; silicon diagnosis; multiprocessor systems; nanometer technologies; power integrity; and reliable system design.
Keywords
CAD; CMOS integrated circuits; circuit testing; electronics packaging; elemental semiconductors; low-power electronics; multiprocessing systems; network routing; network synthesis; silicon; three-dimensional integrated circuits; 3D IC; CAD; aging aware design; global circuit design; low power system design; low power technologies; multiprocessor systems; nanometer technologies; power integrity; reliable system design; silicon diagnosis; silicon test; system level energy; three dimensional circuits; three dimensional packaging;
fLanguage
English
Publisher
ieee
Conference_Titel
Quality Electronic Design (ISQED), 2013 14th International Symposium on
Conference_Location
Santa Clara, CA
ISSN
1948-3287
Print_ISBN
978-1-4673-4951-2
Type
conf
DOI
10.1109/ISQED.2013.6523575
Filename
6523575
Link To Document