Abstract :
The following topics are dealt with: gallium nitride; qualification; and packaging.
Keywords :
gallium compounds; packaging; reliability; semiconductor materials; compound semiconductors reliability; gallium nitride; packaging; qualification;
Conference_Titel :
Reliability of Compound Semiconductors Digest (ROCS), 2009
Conference_Location :
Greensboro, NC
Print_ISBN :
978-0-7908-0124-7
