• DocumentCode
    2262175
  • Title

    Modeling, analysis, and TCAD of nanoscale devices and circuits

  • Author

    Chuang, Ching-Te

  • Author_Institution
    Dept. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
  • fYear
    2009
  • fDate
    24-27 May 2009
  • Firstpage
    2305
  • Lastpage
    2308
  • Abstract
    This paper discusses the challenges in the modeling, analysis, and TCAD of nanoscale devices and circuits. Compact modeling of gate-oxide related long term degradations, and quantum mechanical and nanoscale effects are addressed. Atomistic simulations and mixed-mode simulations based on fundamental physics for evaluation and exploration of emerging devices and circuits are illustrated. Automated migration to non-planar FinFET device structure is discussed. Fast Monte Carlo algorithm to enable statistical analysis of large scale circuits and memories, and to speed up TCAD computational efficiency is elaborated. The needs for phonon Boltzmann transport based, coupled self-consistent electro-thermal solver/analysis, and full-band Monte Carlo electron-phonon interaction analysis for accurate prediction of self-heating in devices with ultra-thin silicon film are discussed.
  • Keywords
    MOSFET; Monte Carlo methods; electron-phonon interactions; mixed analogue-digital integrated circuits; statistical analysis; technology CAD (electronics); Monte Carlo algorithm; TCAD; atomistic simulations; electron-phonon interaction; long term degradations; mixed-mode simulations; nanoscale circuits; nanoscale devices; nonplanar FinFET device structure; phonon Boltzmann transport; quantum mechanical effects; statistical analysis; ultra-thin silicon film; Circuit simulation; Computational modeling; Degradation; FinFETs; Large-scale systems; Monte Carlo methods; Nanoscale devices; Physics; Quantum mechanics; Statistical analysis;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Circuits and Systems, 2009. ISCAS 2009. IEEE International Symposium on
  • Conference_Location
    Taipei
  • Print_ISBN
    978-1-4244-3827-3
  • Electronic_ISBN
    978-1-4244-3828-0
  • Type

    conf

  • DOI
    10.1109/ISCAS.2009.5118260
  • Filename
    5118260