• DocumentCode
    2263207
  • Title

    Floorplanning and thermal impact on leakage power and proper operation of complex SOC designs

  • Author

    Abadir, Magdy S.

  • Author_Institution
    Freescale Semicond. Inc., Austin, TX
  • fYear
    0
  • fDate
    0-0 0
  • Abstract
    In this paper, we demonstrate the need for considering the floorplan when the leakage power is calculated for a SoC. We proposed a leakage power estimation methodology which considers the floorplan of the SoC and the cycle-by-cycle dynamic power behavior while estimating leakage power. This methodology has been experimented with on three industrial SoC designs and we observed up to a 44.1% difference in leakage power between various floorplans. We believe that our estimation methodology is generic and can be useful for a wide variety of SoCs
  • Keywords
    integrated circuit design; leakage currents; system-on-chip; SOC designs; dynamic power behavior; leakage power estimation; CMOS technology; Energy consumption; High performance computing; Leakage current; Low power electronics; Manufacturing processes; Power dissipation; System-on-a-chip; Temperature sensors; USA Councils;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    On-Line Testing Symposium, 2006. IOLTS 2006. 12th IEEE International
  • Conference_Location
    Lake Como
  • Print_ISBN
    0-7695-2620-9
  • Type

    conf

  • DOI
    10.1109/IOLTS.2006.39
  • Filename
    1655522