DocumentCode
2263207
Title
Floorplanning and thermal impact on leakage power and proper operation of complex SOC designs
Author
Abadir, Magdy S.
Author_Institution
Freescale Semicond. Inc., Austin, TX
fYear
0
fDate
0-0 0
Abstract
In this paper, we demonstrate the need for considering the floorplan when the leakage power is calculated for a SoC. We proposed a leakage power estimation methodology which considers the floorplan of the SoC and the cycle-by-cycle dynamic power behavior while estimating leakage power. This methodology has been experimented with on three industrial SoC designs and we observed up to a 44.1% difference in leakage power between various floorplans. We believe that our estimation methodology is generic and can be useful for a wide variety of SoCs
Keywords
integrated circuit design; leakage currents; system-on-chip; SOC designs; dynamic power behavior; leakage power estimation; CMOS technology; Energy consumption; High performance computing; Leakage current; Low power electronics; Manufacturing processes; Power dissipation; System-on-a-chip; Temperature sensors; USA Councils;
fLanguage
English
Publisher
ieee
Conference_Titel
On-Line Testing Symposium, 2006. IOLTS 2006. 12th IEEE International
Conference_Location
Lake Como
Print_ISBN
0-7695-2620-9
Type
conf
DOI
10.1109/IOLTS.2006.39
Filename
1655522
Link To Document