• DocumentCode
    2263836
  • Title

    Zero-Hardened SRAM Cells to Improve Soft Error Tolerance in FPGA

  • Author

    Miao, Si ; Ou, Peng ; Zhou, Xuegong ; Wang, Lingli

  • Author_Institution
    State Key Lab. of ASIC & Syst., Fudan Univ., Shanghai
  • Volume
    2
  • fYear
    2008
  • fDate
    20-22 Dec. 2008
  • Firstpage
    278
  • Lastpage
    282
  • Abstract
    Soft errors due to charged particle strikes at the sensitive cell nodes could modify the functionality of the design by changing the configuration bits of an SRAM based FPGA. However, with the development of very-deep-sub-micron (VDSM) or even the nano-technologies, aggressive device size has impacted severely the soft error rate of integrated circuits. In this paper, three new SRAM cell designs are proposed which mainly aim at reducing the soft error rate in FPGA. We verify the soft error tolerance and the power dissipation of these three designs using HSPICE simulation with Berkeley Predictive Technology Model (PTM) of the 65 nm, 1.0 V technology. The simulation results of our three designs are compared with that of standard 6-transistor SRAM cell and an existing increased soft error tolerance cell - ASRAM0. Comparison result shows that our new cells, especially the 0-hardened SRAM cell, have triple the critical charge of the standard 6-transistor SRAM cell, when the cell is storing 0.
  • Keywords
    SPICE; SRAM chips; field programmable gate arrays; transistors; Berkeley predictive technology model; FPGA; HSPICE simulation; integrated circuits; power dissipation; size 65 nm; soft error rate; soft error tolerance; standard 6-transisitor SRAM cell; very-deep-sub-micron; voltage 1.0 V; zero-hardened SRAM cells; Capacitance; Computer errors; Error analysis; Field programmable gate arrays; Integrated circuit reliability; Integrated circuit technology; Predictive models; Random access memory; Routing; Voltage; FPGA; SRAM; Soft error;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Intelligent Information Technology Application, 2008. IITA '08. Second International Symposium on
  • Conference_Location
    Shanghai
  • Print_ISBN
    978-0-7695-3497-8
  • Type

    conf

  • DOI
    10.1109/IITA.2008.336
  • Filename
    4739771