DocumentCode :
2264428
Title :
300 mm full-factory simulations for 90 nm and 65 nm IC manufacturing
Author :
Bass, E.L. ; Pillai, D.D. ; Dempsey, J.C.
Author_Institution :
Intel Corp., Chandler, AZ, USA
fYear :
2003
fDate :
30 Sept.-2 Oct. 2003
Firstpage :
35
Lastpage :
38
Abstract :
We present key results of some enabling capabilities realized by the development and implementation of 300 mm full-factory simulation tools supporting Intel´s 90 nm high-volume manufacturing (HVM) and 65 nm technology development (TD) factories. We discuss key attributes of these simulators which are being utilized for strategic fab capacity planning, automation systems designs, and tactical execution decision-support for continuous improvement. These tools capture the dynamic behaviors of hundreds of production equipment supporting a high-mix environment and integrate automated material handling systems (AMHS) in these production simulations. The paper discusses specific topical areas where these tools have found widespread use and emphasizes the importance of periodic model validation to the real factory.
Keywords :
continuous improvement; electronics industry; integrated circuit design; integrated circuit manufacture; integrated circuit modelling; materials handling equipment; production equipment; production facilities; production planning; 300 mm; 65 nm; 90 nm; IC manufacture; automation systems designs; continuous improvement; full-factory simulations; high-mix environment; high-volume manufacturing; integrate automated material handling systems; production equipment; production simulations; real factory; strategic fab capacity planning; tactical execution decision-support; technology development factories; tools capture; Computational modeling; Data mining; Discrete event simulation; Integrated circuit modeling; Manufacturing automation; Production equipment; Production facilities; Semiconductor device modeling; Vehicle dynamics; Virtual manufacturing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Manufacturing, 2003 IEEE International Symposium on
ISSN :
1523-553X
Print_ISBN :
0-7803-7894-6
Type :
conf
DOI :
10.1109/ISSM.2003.1243225
Filename :
1243225
Link To Document :
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