Title :
Real time monitor of Cu pollution in clean room ambient near Cu CMP equipment
Author :
Sasaki, Motoharu ; Itou, Y. ; Kanbe, T. ; Arikado, T.
Author_Institution :
SELETE, Tsukuba, Japan
fDate :
30 Sept.-2 Oct. 2003
Abstract :
QCM was applied to measure Cu pollution in the vicinity of the Cu CMP equipment. QCM can detect the cupriferous mist seeping out from the CMP chamber to the environment successfully. The mist spreads throughout the tool, but not diffusely from the tool into the clean room ambient, except when performing maintenance by opening the equipment panel. Based on the experimental results, the Cu wiring area has been directly connected to other areas by opening the door isolating them.
Keywords :
air pollution measurement; chemical mechanical polishing; clean rooms; copper; integrated circuit manufacture; Cu; Cu CMP; Cu pollution; Cu wiring; QCM measurement; cupriferous mist seeping; real time monitoring; Contamination; Degradation; Equations; Frequency; Large scale integration; Manufacturing; Monitoring; Pollution measurement; Productivity; Wiring;
Conference_Titel :
Semiconductor Manufacturing, 2003 IEEE International Symposium on
Print_ISBN :
0-7803-7894-6
DOI :
10.1109/ISSM.2003.1243240