• DocumentCode
    2264715
  • Title

    Real time monitor of Cu pollution in clean room ambient near Cu CMP equipment

  • Author

    Sasaki, Motoharu ; Itou, Y. ; Kanbe, T. ; Arikado, T.

  • Author_Institution
    SELETE, Tsukuba, Japan
  • fYear
    2003
  • fDate
    30 Sept.-2 Oct. 2003
  • Firstpage
    99
  • Lastpage
    102
  • Abstract
    QCM was applied to measure Cu pollution in the vicinity of the Cu CMP equipment. QCM can detect the cupriferous mist seeping out from the CMP chamber to the environment successfully. The mist spreads throughout the tool, but not diffusely from the tool into the clean room ambient, except when performing maintenance by opening the equipment panel. Based on the experimental results, the Cu wiring area has been directly connected to other areas by opening the door isolating them.
  • Keywords
    air pollution measurement; chemical mechanical polishing; clean rooms; copper; integrated circuit manufacture; Cu; Cu CMP; Cu pollution; Cu wiring; QCM measurement; cupriferous mist seeping; real time monitoring; Contamination; Degradation; Equations; Frequency; Large scale integration; Manufacturing; Monitoring; Pollution measurement; Productivity; Wiring;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Manufacturing, 2003 IEEE International Symposium on
  • ISSN
    1523-553X
  • Print_ISBN
    0-7803-7894-6
  • Type

    conf

  • DOI
    10.1109/ISSM.2003.1243240
  • Filename
    1243240