DocumentCode
2264715
Title
Real time monitor of Cu pollution in clean room ambient near Cu CMP equipment
Author
Sasaki, Motoharu ; Itou, Y. ; Kanbe, T. ; Arikado, T.
Author_Institution
SELETE, Tsukuba, Japan
fYear
2003
fDate
30 Sept.-2 Oct. 2003
Firstpage
99
Lastpage
102
Abstract
QCM was applied to measure Cu pollution in the vicinity of the Cu CMP equipment. QCM can detect the cupriferous mist seeping out from the CMP chamber to the environment successfully. The mist spreads throughout the tool, but not diffusely from the tool into the clean room ambient, except when performing maintenance by opening the equipment panel. Based on the experimental results, the Cu wiring area has been directly connected to other areas by opening the door isolating them.
Keywords
air pollution measurement; chemical mechanical polishing; clean rooms; copper; integrated circuit manufacture; Cu; Cu CMP; Cu pollution; Cu wiring; QCM measurement; cupriferous mist seeping; real time monitoring; Contamination; Degradation; Equations; Frequency; Large scale integration; Manufacturing; Monitoring; Pollution measurement; Productivity; Wiring;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Manufacturing, 2003 IEEE International Symposium on
ISSN
1523-553X
Print_ISBN
0-7803-7894-6
Type
conf
DOI
10.1109/ISSM.2003.1243240
Filename
1243240
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