Ultra-thin chip fabrication for next-generation silicon processes

Ultra-thin chip technology is identified as an enabler for overcoming bottlenecks in microelectronics, such as 3D integration, and for leading to new applications, such as hybrid, flexible system-in-foil (SiF). This, however, calls for new techniques in fabricating very thin wafers or chips, in applying them to device integration processes and in assembly and packaging. The application to SiF requires that the ultra-thin chips feature excellent mechanical reliability and flexibility. This paper focuses on a recently introduced novel technology, called Chipfilmtrade, for fabricating ultra-thin chips. The technology consists of a pre-process Chipfilmtrade and a post-process Pick, Crack&Placetrade. Particular attention is paid to the design and characterization to the mechanical anchors that are broken in the Pick, Crack&Place process to singulate the thin chips. Also discussed is the characterization of the chip´s mechanical stability and flexibility.