Advanced interconnecting techniques of integrated T/R modules

Author

Wei, Yan ; Weizhuo, Jiang ; Tingyue, Wang ; Lianzhong, Xie ; Xiaoxuan, Li

Author_Institution

Nanjing Res. Inst. of Electron. Technol., China

fYear

2001

fDate

2001

Firstpage

893

Lastpage

897

Abstract

The basic requirements for transmit/receive(T/R) modules of active phased array radar systems are small volume and light weight with excellent microwave performance and uniformity. The objective of this study was to employ new interconnecting techniques to develop high density, integrated T/R modules. Many advanced interconnecting methods were applied to increase the package density and improve the electric performance. High density, integrated T/R modules with good microwave performance and uniformity were manufactured successfully. These techniques are very useful to many types of modern active phased array radar systems

Keywords

integrated circuit interconnections; integrated circuit packaging; microwave receivers; phased array radar; radar receivers; radar transmitters; transceivers; active phased array radar; high density T/R modules; integrated T/R modules; interconnecting techniques; microwave performance; package density; transmit/receive modules; uniformity; Distributed parameter circuits; Integrated circuit interconnections; Joining processes; Manufacturing; Microwave devices; Microwave theory and techniques; Nonhomogeneous media; Phased arrays; Power transmission lines; Radar antennas;

fLanguage

English

Publisher

ieee

Conference_Titel

Radar, 2001 CIE International Conference on, Proceedings

Conference_Location

Beijing

Print_ISBN

0-7803-7000-7

Type

conf

DOI

10.1109/ICR.2001.984855

Filename

984855