Title :
Advanced interconnecting techniques of integrated T/R modules
Author :
Wei, Yan ; Weizhuo, Jiang ; Tingyue, Wang ; Lianzhong, Xie ; Xiaoxuan, Li
Author_Institution :
Nanjing Res. Inst. of Electron. Technol., China
Abstract :
The basic requirements for transmit/receive(T/R) modules of active phased array radar systems are small volume and light weight with excellent microwave performance and uniformity. The objective of this study was to employ new interconnecting techniques to develop high density, integrated T/R modules. Many advanced interconnecting methods were applied to increase the package density and improve the electric performance. High density, integrated T/R modules with good microwave performance and uniformity were manufactured successfully. These techniques are very useful to many types of modern active phased array radar systems
Keywords :
integrated circuit interconnections; integrated circuit packaging; microwave receivers; phased array radar; radar receivers; radar transmitters; transceivers; active phased array radar; high density T/R modules; integrated T/R modules; interconnecting techniques; microwave performance; package density; transmit/receive modules; uniformity; Distributed parameter circuits; Integrated circuit interconnections; Joining processes; Manufacturing; Microwave devices; Microwave theory and techniques; Nonhomogeneous media; Phased arrays; Power transmission lines; Radar antennas;
Conference_Titel :
Radar, 2001 CIE International Conference on, Proceedings
Conference_Location :
Beijing
Print_ISBN :
0-7803-7000-7
DOI :
10.1109/ICR.2001.984855
