• DocumentCode
    2265312
  • Title

    Corona stabilization at negative impulse stress in SF6 and SF6-N2-mixtures

  • Author

    Pfeiffer, W. ; Welke, H. ; Zimmer, V.

  • Author_Institution
    Tech. Hochschule, Darmstadt, West Germany
  • fYear
    1989
  • fDate
    29 Oct-2 Nov 1989
  • Firstpage
    75
  • Lastpage
    80
  • Abstract
    Measurements have been made to evaluate the characteristics of impulse corona at negative impulse stress. It is shown that for the parameters investigated the corona onset voltage is a linear function of the degree of homogeneity of the electrode arrangement for different pressures and mixture ratios. It is also shown that the corona onset voltage is a linear function of the pressure for different gap distances and mixture ratios for the parameters investigated. The breakdown voltage at impulse stress has been measured for a constant formative time lag, for different gap distances, for various degrees of homogeneity (η=Emean/Emax was varied from 0.76 to 0.04), and for different SF6-N2 mixtures. Measurements of the breakdown voltage have shown that the corona stabilizing effect exists up to a mixture ratio of 10% SF6 to N2. It has been found that a slightly inhomogeneous electrode arrangement (η=0.26) has a lower dielectric strength than a strongly inhomogeneous electrode arrangement (η=0.04)
  • Keywords
    corona; electric breakdown of gases; electric strength; gaseous insulation; nitrogen; sulphur compounds; SF6; SF6-N2 mixtures; breakdown voltage; corona onset voltage; corona stabilisation; dielectric strength; formative time lag; gap distances; gaseous insulation; impulse corona; mixture ratios; negative impulse stress; Corona; Delay; Electrodes; Pulse generation; Pulse measurements; Pulse width modulation; Stress measurement; Sulfur hexafluoride; Testing; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation and Dielectric Phenomena, 1989. Annual Report., Conference on
  • Conference_Location
    Leesburg, VA
  • Type

    conf

  • DOI
    10.1109/CEIDP.1989.69526
  • Filename
    69526