• DocumentCode
    2265335
  • Title

    Transistor sensitivity to energy contamination from decelerated BF2 and As ion implantation

  • Author

    Bernstein, J.D. ; Alvarez, A.W. ; Cherukuri, K.C.

  • Author_Institution
    Texas Instrum. Inc., Dallas, TX, USA
  • fYear
    2003
  • fDate
    30 Sept.-2 Oct. 2003
  • Firstpage
    214
  • Lastpage
    217
  • Abstract
    Decel mode implantation provides a significant increase in beam current at low implant energies. In this work, we investigate decel-induced energy contamination in NMOS and PMOS source/drain (S/D) extension implants. Drift mode, decel mode, and dual-energy drift mode implants are used to obtain transistor parametric sensitivity to the dose of energy contamination. In addition, we characterize implant-to-implant repeatability of energy contamination. The results are used to estimate the effect on transistor parametric variation in a manufacturing environment.
  • Keywords
    MOSFET; arsenic; boron compounds; ion implantation; semiconductor device manufacture; semiconductor device measurement; As; BF2; BF2 implantation; NMOS; PMOS; beam current; decel induced energy contamination; decel mode implantation; drift mode; dual energy drift mode implants; energy contamination; ion implantation; manufacturing environment; source/drain extension implants; transistor parametric sensitivity; CMOS technology; Contamination; Implants; Instruments; Ion implantation; MOS devices; Manufacturing; Pollution measurement; Space charge; Throughput;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Manufacturing, 2003 IEEE International Symposium on
  • ISSN
    1523-553X
  • Print_ISBN
    0-7803-7894-6
  • Type

    conf

  • DOI
    10.1109/ISSM.2003.1243268
  • Filename
    1243268