DocumentCode
2265335
Title
Transistor sensitivity to energy contamination from decelerated BF2 and As ion implantation
Author
Bernstein, J.D. ; Alvarez, A.W. ; Cherukuri, K.C.
Author_Institution
Texas Instrum. Inc., Dallas, TX, USA
fYear
2003
fDate
30 Sept.-2 Oct. 2003
Firstpage
214
Lastpage
217
Abstract
Decel mode implantation provides a significant increase in beam current at low implant energies. In this work, we investigate decel-induced energy contamination in NMOS and PMOS source/drain (S/D) extension implants. Drift mode, decel mode, and dual-energy drift mode implants are used to obtain transistor parametric sensitivity to the dose of energy contamination. In addition, we characterize implant-to-implant repeatability of energy contamination. The results are used to estimate the effect on transistor parametric variation in a manufacturing environment.
Keywords
MOSFET; arsenic; boron compounds; ion implantation; semiconductor device manufacture; semiconductor device measurement; As; BF2; BF2 implantation; NMOS; PMOS; beam current; decel induced energy contamination; decel mode implantation; drift mode; dual energy drift mode implants; energy contamination; ion implantation; manufacturing environment; source/drain extension implants; transistor parametric sensitivity; CMOS technology; Contamination; Implants; Instruments; Ion implantation; MOS devices; Manufacturing; Pollution measurement; Space charge; Throughput;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Manufacturing, 2003 IEEE International Symposium on
ISSN
1523-553X
Print_ISBN
0-7803-7894-6
Type
conf
DOI
10.1109/ISSM.2003.1243268
Filename
1243268
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