Title :
Mechanism of PFC reduction with gas circulation RIE system
Author :
Hirayama, Yuzo ; Nagata, Yuichi
Author_Institution :
HALCA Project, Assoc. of Super-Adv. Electron. Technol., Tsukuba, Japan
fDate :
30 Sept.-2 Oct. 2003
Abstract :
We study theoretical calculation and experimentally verify of gas reduction rate with using gas circulation RIE system. 40% reduction of PFC gases is expected as a result of trial calculation, and we successfully achieve significant reduction of PFC gases in dual damascene etching process. Consumption PFC gases are 40-80% reduction, and emission PFC gases are 70-80% reduction. We clarified that the variable factors of reduction rate is largely a result of usage gas kind.
Keywords :
air pollution; global warming; industrial pollution; integrated circuit manufacture; organic compounds; semiconductor device manufacture; sputter etching; dual damascene etching; gas circulation RIE system; gas emission; gas reduction rate; perfluorocarbon gas consumption; perfluorocarbon reduction; theoretical calculation; trial calculation; Absorption; Dielectric films; Equations; Etching; Fluid flow; Gases; Global warming; Plasma applications; Plasma temperature; Production;
Conference_Titel :
Semiconductor Manufacturing, 2003 IEEE International Symposium on
Print_ISBN :
0-7803-7894-6
DOI :
10.1109/ISSM.2003.1243280
