DocumentCode :
2266158
Title :
Efficient three-dimensional LCR extraction and modeling of VLSI packages
Author :
Specks, J.W.
Author_Institution :
Microcontroller Design Center, Motorola Inc., Munich, Germany
fYear :
1993
fDate :
16-18 Aug 1993
Firstpage :
1166
Abstract :
The computational cost of 3-D LCR package modeling is reduced by several techniques. Capacitance extraction uses a novel potential-adapted grid and an iterative equation solver. Inductance calculation is based on a mixed analytical/numerical integration method and a geometry dependent filament approximation. The resulting circuit model automatically takes into account only significant LC couplings
Keywords :
VLSI; circuit analysis computing; computational complexity; crosstalk; integrated circuit interconnections; integrated circuit packaging; iterative methods; LC couplings; VLSI packages; capacitance extraction; circuit model; circuit simulation; computational cost; crosstalk; geometry dependent filament approximation; inductance calculation; iterative equation solver; mixed analytical/numerical integration method; multiconductor systems; potential-adapted grid; three-dimensional LCR extraction; Capacitance; Circuits; Computational efficiency; Conductors; Equations; Geometry; Inductance; Mesh generation; Packaging; Very large scale integration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Circuits and Systems, 1993., Proceedings of the 36th Midwest Symposium on
Conference_Location :
Detroit, MI
Print_ISBN :
0-7803-1760-2
Type :
conf
DOI :
10.1109/MWSCAS.1993.343298
Filename :
343298
Link To Document :
بازگشت